公开(公告)号：US06582223B2

公开(公告)日：2003-06-24

申请号：US09990257

申请日：2001-11-23

申请人： Hiroshi Yasumura ,  Tadayuki Into ,  Noriki Iwasaki ,  Yasuhiro Goto ,  Tatsuyuki Ishioka

发明人： Hiroshi Yasumura ,  Tadayuki Into ,  Noriki Iwasaki ,  Yasuhiro Goto ,  Tatsuyuki Ishioka

IPC分类号： F27D500

CPC分类号： H01L21/6838

摘要： A semiconductor chip pickup apparatus of the present invention includes an aspiration section and an aspiration unit connected to the aspiration section, in which the aspiration unit includes a stage for mounting the semiconductor chip thereon and an adhesive sheet is attached to the semiconductor chip between the stage and the semiconductor chip, the stage includes undulations in at least a part of an area in which the semiconductor chip is mounted, and by operating the aspiration section, a suction force is applied to at least a part of an area in which the undulations are formed.