公开(公告)号：US20050146003A1

公开(公告)日：2005-07-07

申请号：US10750308

申请日：2003-12-31

申请人： Michael O'Connor ,  Thomas Springett ,  Paul Ward-Dolkas

发明人： Michael O'Connor ,  Thomas Springett ,  Paul Ward-Dolkas

IPC分类号： G02F1/13 ,  H01L21/44 ,  H01L23/02 ,  H01L31/0203

CPC分类号： G02F1/133308 ,  G02F1/1333 ,  G02F1/136277 ,  G02F2201/54 ,  G02F2203/60

摘要： Some embodiments provide a microdisplay integrated circuit (IC), a substantially transparent protective cover coupled to the microdisplay IC, and a base coupled to the microdisplay IC. Thermal expansion characteristics of the base may be substantially similar to thermal expansion characteristics of the protective cover. According to some embodiments, at least one set of imaging elements is fabricated on an upper surface of a semiconductor substrate, and a base is affixed to a lower surface of the semiconductor substrate to generate substantially negligible mechanical stress between the semiconductor substrate and the base.

摘要翻译： 一些实施例提供微显示器集成电路（IC），耦合到微显示器IC的基本上透明的保护盖，以及耦合到微显示器IC的基极。 基底的热膨胀特性可基本上类似于保护罩的热膨胀特性。 根据一些实施例，在半导体衬底的上表面上制造至少一组成像元件，并且将基底固定到半导体衬底的下表面，以在半导体衬底和基底之间产生基本上可忽略的机械应力。