公开(公告)号：US20160127620A1

公开(公告)日：2016-05-05

申请号：US14531252

申请日：2014-11-03

Applicant: JIA-TIN-CHANG CO., LTD.

Inventor： Yen-Ting LEE

IPC: H04N5/225

CPC classification number: H04N5/2254 ,  G03B3/10 ,  G03B17/04 ,  G03B29/00 ,  H04M1/0264 ,  H04M2250/20 ,  H04N5/2252

Abstract: A camera module comprises a pivot and a lens barrel. The pivot comprises a first end portion and a second end portion opposite to the first end portion. The lens barrel is connected to the pivot, and comprises a camera lens, a focusing structure located on the lens barrel, and a pivoting portion opposite to the camera lens. The pivoting portion can rotatably pivot on the first end portion of the pivot. In another aspect, an electronic device comprises the camera module and a body, the body comprising an engaging end and an abutment surface adjacent to the engaging end; wherein the engaging end is connected to the second end portion of the pivot of the camera module. The camera module can be telescopically rotated when the electronic device is equipped with the camera module, so that the camera module can shoot images from multi-faceted perspectives.

Abstract translation: 相机模块包括枢轴和镜筒。 枢轴包括第一端部和与第一端部相对的第二端部。 透镜筒连接到枢轴，并且包括相机镜头，位于透镜镜筒上的聚焦结构以及与照相机镜头相对的枢转部分。 枢转部分可旋转地枢转在枢轴的第一端部上。 在另一方面，电子设备包括相机模块和主体，主体包括接合端和与接合端相邻的邻接表面; 其中所述接合端连接到相机模块的枢轴的第二端部。 当电子设备配备相机模块时，相机模块可以伸缩旋转，以便相机模块可以从多面视角拍摄图像。

公开(公告)号：US20080310122A1

公开(公告)日：2008-12-18

申请号：US11960742

申请日：2007-12-20

Applicant: MING-DER CHOU ,  YAO-TIN CHANG

Inventor： MING-DER CHOU ,  YAO-TIN CHANG

IPC: H05K7/20 ,  F28F7/02

CPC classification number: H01L23/427 ,  F28D15/0233 ,  F28D15/0275 ,  H01L23/4006 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An exemplary thermal dissipating device is for cooling an electronic component of a circuit board. The thermal dissipating device includes a heat conductive plate with a first side and a second side opposite to the first side, a plurality of heat pipes, and a plurality of fin arrays. The heat conductive plate includes a first part with the first side in closely contact with the electronic component, and a second part perpendicularly disposed beside the first part. The heat pipes are embedded in the second side of the conductive plate, extending from the first part to the second part. One of the fin arrays is attached to the second side of the first part of the conductive plate. The others of the fin arrays are attached to the second part of the conductive plate the first and second sides respectively.

Abstract translation: 一种示例性的散热装置用于冷却电路板的电子部件。 散热装置包括具有第一侧和与第一侧相对的第二侧的导热板，多个热管和多个翅片阵列。 导热板包括具有与电子部件紧密接触的第一侧的第一部分和垂直设置在第一部分旁边的第二部分。 热管嵌入导电板的第二侧，从第一部分延伸到第二部分。 翅片阵列中的一个附接到导电板的第一部分的第二侧。 翅片阵列中的其他部分分别在第一和第二侧附着到导电板的第二部分。

公开(公告)号：US07580262B2

公开(公告)日：2009-08-25

申请号：US11967040

申请日：2007-12-29

Applicant: Ming-Der Chou ,  Yao-Tin Chang

Inventor： Ming-Der Chou ,  Yao-Tin Chang

IPC: H05K7/20

CPC classification number: G06F1/20 ,  H01L23/4093 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20809 ,  H01L2924/00

Abstract: A heat dissipation assembly mounted to a main board in a blade server includes a graphics card, a heat sink, and a thermal board. The graphics card includes a GPU and a plurality of first graphics memory chips mounted on a top thereof, and a plurality of second graphics memory chips mounted on a bottom thereof. The heat sink for cooling the GPU and the first graphics memory chips, includes a base attached to the top of the graphics card, a finned part fixed to a top of the base, and a heat pipe sandwiched between the base and the finned part. A pathway of the heat pipe passes over the GPU and at least part of the first graphics memory chips of the graphics card. The thermal board is mounted to the bottom of the graphics card for cooling the second graphics memory chips.

Abstract translation: 安装到刀片服务器中的主板的散热组件包括显卡，散热器和热板。 图形卡包括GPU和安装在其顶部的多个第一图形存储器芯片，以及安装在其底部的多个第二图形存储器芯片。 用于冷却GPU和第一图形存储器芯片的散热器包括附接到图形卡的顶部的基座，固定到基座的顶部的翅片部分和夹在基部和翅片部分之间的热管。 热管的路径通过GPU和图形卡的至少部分第一图形存储器芯片。 热敏电路板安装在图形卡的底部，用于冷却第二个图形存储器芯片。

公开(公告)号：US07576986B2

公开(公告)日：2009-08-18

申请号：US11960742

申请日：2007-12-20

Applicant: Ming-Der Chou ,  Yao-Tin Chang

Inventor： Ming-Der Chou ,  Yao-Tin Chang

IPC: H05K7/20

CPC classification number: H01L23/427 ,  F28D15/0233 ,  F28D15/0275 ,  H01L23/4006 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An exemplary thermal dissipating device is for cooling an electronic component of a circuit board. The thermal dissipating device includes a heat conductive plate with a first side and a second side opposite to the first side, a plurality of heat pipes, and a plurality of fin arrays. The heat conductive plate includes a first part with the first side in closely contact with the electronic component, and a second part perpendicularly disposed beside the first part. The heat pipes are embedded in the second side of the conductive plate, extending from the first part to the second part. One of the fin arrays is attached to the second side of the first part of the conductive plate. The others of the fin arrays are attached to the second part of the conductive plate the first and second sides respectively.

Abstract translation: 一种示例性的散热装置用于冷却电路板的电子部件。 散热装置包括具有第一侧和与第一侧相对的第二侧的导热板，多个热管和多个翅片阵列。 导热板包括具有与电子部件紧密接触的第一侧的第一部分和垂直设置在第一部分旁边的第二部分。 热管嵌入导电板的第二侧，从第一部分延伸到第二部分。 翅片阵列中的一个附接到导电板的第一部分的第二侧。 翅片阵列中的其他部分分别在第一和第二侧附着到导电板的第二部分。

公开(公告)号：US20160055554A1

公开(公告)日：2016-02-25

申请号：US14467934

申请日：2014-08-25

Applicant: Jia-Tin-Chang Co., Ltd.

Inventor： Yen-Tin Lee

IPC: G06Q30/06 ,  H05K5/00 ,  H05K5/02 ,  G06F1/16

CPC classification number: G06Q30/0603 ,  G06F1/1626 ,  G06Q30/0641 ,  H05K5/0239

Abstract: An electronic catalog has a body and an exhibition apparatus. The body is an exterior protecting structure. The exhibition apparatus has a display module, a control module and an input module. The display module is mounted in the exhibition apparatus and has a screen mounted on the exhibition apparatus. The control module is electrically connected to the display module. The input module is mounted on the exhibition apparatus and is electrically connected to the control module. The input module has a storage mounted in the exhibition apparatus, and a slot disposed on the exhibition apparatus and electrically connected to the storage. Digital files are stored into the exhibition apparatus via the slot and are displayed on the screen. Thus, the old digital files can be replaced by processing files of new products rather than making new paper catalogs, thereby decreasing cost, saving resources, and facilitating convenience.

Abstract translation: 电子目录具有主体和展示装置。 身体是一个外部保护结构。 展示装置具有显示模块，控制模块和输入模块。 显示模块安装在展览装置中，并具有安装在展览装置上的屏幕。 控制模块电连接到显示模块。 输入模块安装在展示装置上，并与控制模块电连接。 输入模块具有安装在展示装置中的存储器，以及设置在展示装置上并与存储器电连接的槽。 数字文件通过插槽存储在展览设备中，并显示在屏幕上。 因此，旧的数字文件可以由新产品的处理文件替代，而不是制作新的纸张目录，从而降低成本，节约资源，便于使用。

公开(公告)号：US20090122480A1

公开(公告)日：2009-05-14

申请号：US11967040

申请日：2007-12-29

Applicant: MING-DER CHOU ,  YAO-TIN CHANG

Inventor： MING-DER CHOU ,  YAO-TIN CHANG

IPC: H05K7/20

CPC classification number: G06F1/20 ,  H01L23/4093 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20809 ,  H01L2924/00

Abstract: A heat dissipation assembly mounted to a main board in a blade server includes a graphics card, a heat sink, and a thermal board. The graphics card includes a GPU and a plurality of first graphics memory chips mounted on a top thereof, and a plurality of second graphics memory chips mounted on a bottom thereof. The heat sink for cooling the GPU and the first graphics memory chips, includes a base attached to the top of the graphics card, a finned part fixed to a top of the base, and a heat pipe sandwiched between the base and the finned part. A pathway of the heat pipe passes over the GPU and at least part of the first graphics memory chips of the graphics card. The thermal board is mounted to the bottom of the graphics card for cooling the second graphics memory chips.

Abstract translation: 安装到刀片服务器中的主板的散热组件包括显卡，散热器和热板。 图形卡包括GPU和安装在其顶部的多个第一图形存储器芯片，以及安装在其底部的多个第二图形存储器芯片。 用于冷却GPU和第一图形存储器芯片的散热器包括附接到图形卡的顶部的基座，固定到基座的顶部的翅片部分和夹在基部和翅片部分之间的热管。 热管的路径通过GPU和图形卡的至少部分第一图形存储器芯片。 热敏电路板安装在图形卡的底部，用于冷却第二个图形存储器芯片。

公开(公告)号：US06685503B1

公开(公告)日：2004-02-03

申请号：US10329516

申请日：2002-12-27

Applicant: James Huang ,  Tin Chang

Inventor： James Huang ,  Tin Chang

IPC: A01R1360

CPC classification number: G06F1/184 ,  G06F1/188 ,  H05K7/20172

Abstract: An AC adapter mounting structure is constructed to include a housing holding a rack. The housing has two vertical pivot rods and two locating holes symmetrically disposed in top and bottom sides of a side opening thereof, and an AC adapter for positioning in the rack inside the housing. The AC adapter has two pivots respectively pivoted in the pivot holes, two short positioning rods for engaging the locating holes of the housing after the pivots are pivoted in the pivot holes and the AC adapter is turned to the inside of the housing, and two stop blocks, which are forced into engagement with respective retaining holes in the rack when the AC adapter is set into the inside of the housing.

Abstract translation: AC适配器安装结构被构造成包括容纳机架的壳体。 壳体具有两个垂直枢轴杆和两个对称地设置在其侧开口的顶侧和底侧中的定位孔，以及用于定位在壳体内的齿条中的AC适配器。 AC适配器具有分别在枢轴孔中枢转的两个枢轴，两个短定位杆，用于在枢轴在枢轴孔中枢转并且AC适配器转动到壳体的内部之后接合壳体的定位孔，并且两个停止 块，当AC适配器被设置在壳体的内部时，它们被迫与齿条中的相应的保持孔接合。