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1.发明授权公开(公告)号：US07379288B2
公开(公告)日：2008-05-27
申请号：US10565168
申请日：2005-02-01
IPC分类号： H01G4/06
摘要： The monolithic ceramic electronic component includes a first external electrode 5, a second external electrode 6, and a ceramic sintered compact 4 including internal electrodes 2 and 3, the first and second external electrodes 5 and 6 being disposed on both end faces 4a and 4b of the ceramic sintered compact 4. The first and second external electrodes 5 and 6 have a multilayer structure in which sintered electrode layers 5a and 6a, intermediate electroplated layers 5b and 6b, and plated layers 5c and 6c are arranged in that order. Exposed surface regions 7a of insulating oxides 7 are exposed from the outer faces of the sintered electrode layers 5a and 6a, the oxides 7 being derived from a glass frit contained in the sintered electrode layers. Metals 8 are deposited on the exposed surface regions 7a and the intermediate electroplated layers 5b and 6b are then formed by electroplating.
摘要翻译： 单片陶瓷电子部件包括第一外部电极5，第二外部电极6和包括内部电极2和3的陶瓷烧结体4，第一外部电极5和第二外部电极6设置在两个端面4a和4上 第一和第二外部电极5和6具有多层结构，其中烧结电极层5a和6a，中间电镀层5b和6b以及镀层5c和6c是 按顺序排列。 绝缘氧化物7的暴露表面区域7a从烧结电极层5a和6a的外表面露出，氧化物7源自包含在烧结电极层中的玻璃料。 金属8沉积在暴露的表面区域7a上，然后通过电镀形成中间电镀层5b和6b。
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2.发明申请公开(公告)号：US20070109718A1
公开(公告)日：2007-05-17
申请号：US10565168
申请日：2005-02-01
IPC分类号： H01G4/228
摘要： The monolithic ceramic electronic component includes a first external electrode 5, a second external electrode 6, and a ceramic sintered compact 4 including internal electrodes 2 and 3, the first and second external electrodes 5 and 6 being disposed on both end faces 4a and 4b of the ceramic sintered compact 4. The first and second external electrodes 5 and 6 have a multilayer structure in which sintered electrode layers 5a and 6a, intermediate electroplated layers 5b and 6b, and plated layers 5c and 6c are arranged in that order. Exposed surface regions 7a of insulating oxides 7 are exposed from the outer faces of the sintered electrode layers 5a and 6a, the oxides 7 being derived from a glass frit contained in the sintered electrode layers. Metals 8 are deposited on the exposed surface regions 7a and the intermediate electroplated layers 5b and 6b are then formed by electroplating.
摘要翻译： 单片陶瓷电子部件包括第一外部电极5，第二外部电极6和包括内部电极2和3的陶瓷烧结体4，第一外部电极5和第二外部电极6设置在两个端面4a和4上 第一和第二外部电极5和6具有多层结构，其中烧结电极层5a和6a，中间电镀层5b和6b以及镀层5c和6c是 按顺序排列。 绝缘氧化物7的暴露表面区域7a从烧结电极层5a和6a的外表面露出，氧化物7源自包含在烧结电极层中的玻璃料。 金属8沉积在暴露的表面区域7a上，然后通过电镀形成中间电镀层5b和6b。
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