公开(公告)号：US08657455B2

公开(公告)日：2014-02-25

申请号：US13410713

申请日：2012-03-02

Applicant: Toshi Yagi ,  Masato Gomi ,  Hisayoshi Daicho

Inventor： Toshi Yagi ,  Masato Gomi ,  Hisayoshi Daicho

IPC: F21V33/00

CPC classification number: F21K9/23 ,  F21K9/238 ,  F21V3/062 ,  F21V3/10 ,  F21V23/006 ,  F21V29/773 ,  F21Y2115/10 ,  H01L33/505 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An LED lamp has a lamp body, a base provided on one end of the lamp body, a light transmissive cover provided on an opposite side of the lamp body from the base, a light source substrate disposed inside the light transmissive cover, and at least one LED unit mounted on the light source substrate. The LED unit has an LED chip and a light transmissive encapsulant encapsulating the LED chip. The LED chip is mounted on the light source substrate. The encapsulant is molded such that the encapsulant is raised from the light source substrate. The LED unit radiates light from an entire surface of the encapsulant in an angular range including a region around a periphery of the LED unit.

Abstract translation: LED灯具有灯体，设置在灯体的一端的基座，设置在灯体的与基座相反的一侧的透光罩，设置在透光罩内部的光源基板，至少 一个LED单元安装在光源基板上。 LED单元具有封装LED芯片的LED芯片和透光密封剂。 LED芯片安装在光源基板上。 密封剂被模制成使得密封剂从光源基底升起。 LED单元在包括围绕LED单元的周边的区域的角度范围内辐射来自密封剂的整个表面的光。