公开(公告)号：US08657455B2

公开(公告)日：2014-02-25

申请号：US13410713

申请日：2012-03-02

申请人： Toshi Yagi ,  Masato Gomi ,  Hisayoshi Daicho

发明人： Toshi Yagi ,  Masato Gomi ,  Hisayoshi Daicho

IPC分类号： F21V33/00

CPC分类号： F21K9/23 ,  F21K9/238 ,  F21V3/062 ,  F21V3/10 ,  F21V23/006 ,  F21V29/773 ,  F21Y2115/10 ,  H01L33/505 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED lamp has a lamp body, a base provided on one end of the lamp body, a light transmissive cover provided on an opposite side of the lamp body from the base, a light source substrate disposed inside the light transmissive cover, and at least one LED unit mounted on the light source substrate. The LED unit has an LED chip and a light transmissive encapsulant encapsulating the LED chip. The LED chip is mounted on the light source substrate. The encapsulant is molded such that the encapsulant is raised from the light source substrate. The LED unit radiates light from an entire surface of the encapsulant in an angular range including a region around a periphery of the LED unit.

摘要翻译： LED灯具有灯体，设置在灯体的一端的基座，设置在灯体的与基座相反的一侧的透光罩，设置在透光罩内部的光源基板，至少 一个LED单元安装在光源基板上。 LED单元具有封装LED芯片的LED芯片和透光密封剂。 LED芯片安装在光源基板上。 密封剂被模制成使得密封剂从光源基底升起。 LED单元在包括围绕LED单元的周边的区域的角度范围内辐射来自密封剂的整个表面的光。

公开(公告)号：US20120224352A1

公开(公告)日：2012-09-06

申请号：US13410713

申请日：2012-03-02

申请人： Toshio Yagi ,  Masato Gomi ,  Hisayoshi Daicho

发明人： Toshio Yagi ,  Masato Gomi ,  Hisayoshi Daicho

IPC分类号： F21V9/16 ,  F21V11/00

CPC分类号： F21K9/23 ,  F21K9/238 ,  F21V3/062 ,  F21V3/10 ,  F21V23/006 ,  F21V29/773 ,  F21Y2115/10 ,  H01L33/505 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED lamp has a lamp body, a base provided on one end of the lamp body, a light transmissive cover provided on an opposite side of the lamp body from the base, a light source substrate disposed inside the light transmissive cover, and at least one LED unit mounted on the light source substrate. The LED unit has an LED chip and a light transmissive encapsulant encapsulating the LED chip. The LED chip is mounted on the light source substrate. The encapsulant is molded such that the encapsulant is raised from the light source substrate. The LED unit radiates light from an entire surface of the encapsulant in an angular range including a region around a periphery of the LED unit.

摘要翻译： LED灯具有灯体，设置在灯体的一端的基座，设置在灯体的与基座相反的一侧的透光罩，设置在透光罩内部的光源基板，至少 一个LED单元安装在光源基板上。 LED单元具有封装LED芯片的LED芯片和透光密封剂。 LED芯片安装在光源基板上。 密封剂被模制成使得密封剂从光源基底升起。 LED单元在包括围绕LED单元的周边的区域的角度范围内辐射来自密封剂的整个表面的光。

公开(公告)号：US5678335A

公开(公告)日：1997-10-21

申请号：US413700

申请日：1995-03-30

申请人： Masato Gomi ,  Noriaki Ito ,  Yasuo Nakamura

发明人： Masato Gomi ,  Noriaki Ito ,  Yasuo Nakamura

IPC分类号： G09F9/302 ,  G09F9/33 ,  G09F13/04 ,  G09F21/04

CPC分类号： G09F13/0409 ,  G09F9/302 ,  G09F9/33 ,  G09F2013/0472 ,  Y10S362/80 ,  Y10S362/812

摘要： A display groove is formed along a display pattern provided on a display panel, and a display element unit is arranged along the display groove as a light source to constitute a display device. The display element unit 2 has one or more LED's inserted into a unit case 21 having an elongated opening so that light is emitted over the width area and the length area of this lens 25 for providing an emitted state of a wide display pattern along a display groove in a small number of LED's 231 along the display pattern.

摘要翻译： 沿着设置在显示面板上的显示图案形成显示槽，并且显示元件单元沿着显示槽布置为光源以构成显示装置。 显示元件单元2具有插入具有细长开口的单元壳体21中的一个或多个LED，使得光在该透镜25的宽度区域和长度区域上发射，以沿着显示器提供宽显示图案的发射状态 沿着显示图案的少量LED 231的凹槽。

公开(公告)号：US07312475B2

公开(公告)日：2007-12-25

申请号：US11151370

申请日：2005-06-14

申请人： Michifumi Nagawa ,  Masato Gomi

发明人： Michifumi Nagawa ,  Masato Gomi

IPC分类号： H01L33/00

CPC分类号： H01S5/18344 ,  H01S5/0425 ,  H01S5/06226 ,  H01S5/18313 ,  H01S2301/176

摘要： To improve the reliability of an optical element and its manufacturing method. An optical element includes a substrate, a columnar section formed above the substrate and having an upper surface for light emission or incidence, a resin layer including a first section formed above the substrate and around the columnar section, and a second section formed at an end section of the upper surface of the columnar section, and an electrode that passes above the first and second sections, of the resin layer and is electrically connected to an end section of an exposed area in the upper surface of the columnar section.

摘要翻译： 提高光学元件的可靠性及其制造方法。 光学元件包括基板，形成在基板上方并具有用于发光或入射的上表面的柱状部分，树脂层，其包括形成在基板上方且围绕柱状部分的第一部分，以及形成在端部的第二部分 柱状部分的上表面的一部分，以及通过树脂层的第一和第二部分之上的电极，并且电连接到柱状部分的上表面中的暴露区域的端部。

公开(公告)号：US20060002440A1

公开(公告)日：2006-01-05

申请号：US11151370

申请日：2005-06-14

申请人： Michifumi Nagawa ,  Masato Gomi

发明人： Michifumi Nagawa ,  Masato Gomi

IPC分类号： H01S5/00

CPC分类号： H01S5/18344 ,  H01S5/0425 ,  H01S5/06226 ,  H01S5/18313 ,  H01S2301/176

摘要： To improve the reliability of an optical element and its manufacturing method. An optical element includes a substrate, a columnar section formed above the substrate and having an upper surface for light emission or incidence, a resin layer including a first section formed above the substrate and around the columnar section, and a second section formed at an end section of the upper surface of the columnar section, and an electrode that passes above the first and second sections, of the resin layer and is electrically connected to an end section of an exposed area in the upper surface of the columnar section.

摘要翻译： 提高光学元件的可靠性及其制造方法。 光学元件包括基板，形成在基板上方并具有用于发光或入射的上表面的柱状部分，树脂层，其包括形成在基板上方且围绕柱状部分的第一部分，以及形成在端部的第二部分 柱状部分的上表面的一部分，以及通过树脂层的第一和第二部分之上的电极，并且电连接到柱状部分的上表面中的暴露区域的端部。