摘要:
A communication system is disclosed for communicating data among a plurality of electronic modules. The communication system may include a data type classifier configured to separate the data into information-type data and signal-type data. The communication system may further include a first communication stack configured to communicate the information-type data among the plurality of electronic modules. The communication system may also include a second communication stack configured to communicate the signal-type data among the plurality of electronic modules. The first communication stack and the second communication stack may share a physical data link.
摘要:
A method of communicating messages includes sending a message. The message has a first protocol data unit (PDU) having a first data portion and a first header portion. The first header portion has a first set of fields containing first data and arranged according to a first structure. The first data portion has a first service data unit (SDU) having a second data portion and a second header portion. The second header portion has the first set of fields containing second data and arranged according to the first structure. The message is received and the first data and the second data for each of the first and second header portions are processed using the same header processing protocol. The first data portion is processed according to a first protocol, and the second data portion is processed according to a second protocol.
摘要:
A communication system is disclosed for communicating data among a plurality of electronic modules. The communication system may include a data type classifier configured to separate the data into information-type data and signal-type data. The communication system may further include a first communication stack configured to communicate the information-type data among the plurality of electronic modules. The communication system may also include a second communication stack configured to communicate the signal-type data among the plurality of electronic modules. The first communication stack and the second communication stack may share a physical data link.