公开(公告)号：US5956574A

公开(公告)日：1999-09-21

申请号：US808420

申请日：1997-02-28

申请人： Seiji Ichikawa ,  Junichi Tanaka ,  Tomoaki Hirokawa ,  Taku Sato ,  Tomoaki Kimura ,  Satoshi Murata ,  Tsutomu Kubota ,  Takeo Ogihara ,  Kenji Uchida ,  Kenji Watanabe ,  Tsutomu Noguti

发明人： Seiji Ichikawa ,  Junichi Tanaka ,  Tomoaki Hirokawa ,  Taku Sato ,  Tomoaki Kimura ,  Satoshi Murata ,  Tsutomu Kubota ,  Takeo Ogihara ,  Kenji Uchida ,  Kenji Watanabe ,  Tsutomu Noguti

IPC分类号： H01L21/56 ,  H01L21/48 ,  H01L23/50 ,  H01L21/44 ,  H01L21/50

CPC分类号： H01L21/4835 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/16152 ,  H01L2924/30107

摘要： In a lead frame flash removing method and apparatus, a lead frame is molded integrally with a case. After molding, abrasive agent-mixed water is sprayed to a surface of the lead frame where a flash is formed. The lead frame is dipped in an electrolytic solution and applying a DC voltage is applied across the lead frame and an electrode in the electrolytic solution, thereby electrolytically processing the lead frame. After the electrolytic process, an external force is applied to the surface of the lead frame, thereby removing the flash.

摘要翻译： 在引线框架闪光去除方法和装置中，引线框架与壳体一体地模制。 在模制之后，将研磨剂混合水喷射到形成闪光的引线框架的表面。 将引线框架浸入电解液中，施加直流电压施加在引线框架和电解液中的电极，由此对引线框架进行电解处理。 在电解处理之后，将外力施加到引线框架的表面，从而去除闪光。