公开(公告)号：US20090191723A1

公开(公告)日：2009-07-30

申请号：US12022161

申请日：2008-01-30

Applicant: Chi-Ching Huang ,  Tzu-Ching Yen ,  Shih-Chieh Lo ,  Wen-Tsung Wu

Inventor： Chi-Ching Huang ,  Tzu-Ching Yen ,  Shih-Chieh Lo ,  Wen-Tsung Wu

IPC: H01L21/02

CPC classification number: G03F7/70733 ,  G03F7/70541

Abstract: Method of performing lithographic processes on a wafer in a lithographic apparatus having multiple stages. First, a lithographic apparatus including a first wafer chuck and a second wafer chuck is provided. Subsequently, a cassette including a plurality of wafers is provided in the lithographic apparatus, and each wafer has a wafer identification. Thereafter, the first wafer chuck is set for holding the wafers having odd wafer identifications, and the second wafer chuck is set for holding the wafers having even wafer identifications. Next, a first lithographic process is performed on each wafer by the lithographic apparatus.

Abstract translation: 在具有多级光刻设备的晶片上进行光刻工艺的方法。 首先，提供包括第一晶片卡盘和第二晶片卡盘的光刻设备。 随后，在光刻设备中设置包括多个晶片的盒，并且每个晶片具有晶片识别。 此后，设置第一晶片卡盘用于保持具有奇数晶片标识的晶片，并且设置第二晶片卡盘用于保持具有均匀晶片标识的晶片。 接下来，通过光刻设备在每个晶片上执行第一光刻工艺。