公开(公告)号：US20070261636A1

公开(公告)日：2007-11-15

申请号：US11615080

申请日：2006-12-22

申请人： Bharath Rangarajan ,  Ramkumar Subramanian ,  Khoi Phan ,  Ursula Quinto ,  Michael Templeton

发明人： Bharath Rangarajan ,  Ramkumar Subramanian ,  Khoi Phan ,  Ursula Quinto ,  Michael Templeton

IPC分类号： B05B1/28

CPC分类号： H01L21/6715 ,  B05B15/50 ,  B05C11/08

摘要： The present invention provides a system and methodology for dummy-dispensing resist though a dispense head while mitigating waste associated with the dummy-dispense process. The dummy dispensed resist is returned to a reservoir from which it was taken. Between substrate applications, the dispense head can be positioned to dispense resist into a return line. The flow of resist from the dispense head keeps resist from drying at the dispense head. By funneling the dummy-dispensed resist into a return line with low volume, for example, waste from the dummy-dispensing process can be mitigated.

摘要翻译： 本发明提供了一种用于分配头的虚拟分配抗蚀剂的系统和方法，同时减轻与虚拟分配过程相关的废物。 虚拟分配的抗蚀剂返回到被采集的储存器。 在基板应用之间，分配头可以被定位成将抗蚀剂分配到返回线中。 来自分配头的抗蚀剂的流动在分配头保持抗干燥。 通过将虚拟分配的抗蚀剂漏出到具有低体积的返回管线中，例如，可以减轻来自虚拟分配过程的废物。