公开(公告)号：US20100065950A1

公开(公告)日：2010-03-18

申请号：US12283647

申请日：2008-09-15

申请人： Michael J. Lowry ,  Eric A. Brauer ,  Thomas A. Degenkolb ,  Victor C.M. Wong

发明人： Michael J. Lowry ,  Eric A. Brauer ,  Thomas A. Degenkolb ,  Victor C.M. Wong

IPC分类号： H01L23/34

CPC分类号： H01L23/49562 ,  H01L23/4334 ,  H01L23/49844 ,  H01L2924/0002 ,  H01L2924/00

摘要： A leaded semiconductor power module includes a first heatsink, an electrically insulated substrate thermally coupled to the first heatsink, one or more semiconductor chips, a leadframe substrate, and a second heatsink thermally coupled to the leadframe substrate, the assembly being overmolded with an encapsulant to expose the first heatsink, the second heatsink and peripheral terminals of the leadframe substrate. The semiconductor chips are electrically and structurally coupled to both the insulated substrate and the leadframe substrate, and conductive spacers electrically and structurally couple the insulated substrate to the leadframe substrate.