公开(公告)号：US20110089025A1

公开(公告)日：2011-04-21

申请号：US12582154

申请日：2009-10-20

申请人： Chih-Chung Yang ,  Mei-Ling Lin ,  Ian-Wei Chian ,  Wen-Cheng Wu ,  Wen-Hsiang Kong ,  Tsai-Hu Chen

发明人： Chih-Chung Yang ,  Mei-Ling Lin ,  Ian-Wei Chian ,  Wen-Cheng Wu ,  Wen-Hsiang Kong ,  Tsai-Hu Chen

IPC分类号： C23C14/14 ,  C23C14/34

CPC分类号： C23C14/3414 ,  C23C14/185 ,  C25D5/12 ,  C25D5/50

摘要： The present invention relates to a method for manufacturing a chip resistor having a low resistance. The method includes the following steps: (a) providing a substrate having a top surface; (b) sputtering a conducting layer directly on the top surface of the substrate, so that the conducting layer and the substrate contact each other, wherein the material of the conducting layer comprises nickel or copper; and (c) plating at least one metal layer directly on the conducting layer, so that the metal layer and the conducting layer contact each other, wherein the material of the metal layer comprises nickel or copper, and the conducting layer and the metal layer provide a resistive layer. As a result, the resistive layer has a precise pattern, and the duration of sputtering is reduced, so the yield rate and the efficiency are improved and the manufacturing cost is cut down.

摘要翻译： 本发明涉及具有低电阻的片式电阻器的制造方法。 该方法包括以下步骤：（a）提供具有顶表面的基底; （b）将导电层直接溅射在衬底的顶表面上，使得导电层和衬底彼此接触，其中导电层的材料包括镍或铜; 和（c）将至少一个金属层直接电镀在导电层上，使得金属层和导电层彼此接触，其中金属层的材料包括镍或铜，导电层和金属层提供 电阻层。 结果，电阻层具有精确的图案，并且降低了溅射持续时间，因此提高了成品率和效率，降低了制造成本。