公开(公告)号：US5023881A

公开(公告)日：1991-06-11

申请号：US540044

申请日：1990-06-19

申请人： David A. Ackerman ,  Greg E. Blonder ,  William M. Mac Donald

发明人： David A. Ackerman ,  Greg E. Blonder ,  William M. Mac Donald

IPC分类号： G02B6/24 ,  G02B6/42 ,  H01S5/00 ,  H01S5/02

CPC分类号： G02B6/4232 ,  G02B6/42 ,  H01S5/0224 ,  H01S5/02268 ,  H01S5/02272

摘要： A laser (24) is mounted in predetermined alignment with a monocrystalline mounting member (11) by defining in the mounting member a reference surface (18) that is displaced from a second surface (19). Solder (29) is placed on a second surface such that in its solid form its length and width each significantly exceeds its height. The laser is bonded to the reference surface such that part of the laser overlies the solder and is separated from the solder by a small gap (30). Next, the solder is melted to cause it to gather on the second surface sufficiently to contact an under surface (31) of the laser. The solder is then cooled such that the solder bonds the laser to the silicon mounting member.