公开(公告)号：US4942190A

公开(公告)日：1990-07-17

申请号：US262937

申请日：1988-10-21

申请人： Masakazu Murayama ,  Ken Kimura ,  Hiroyuki Nakajima ,  Yasuko Ohno ,  Eiki Zidai

发明人： Masakazu Murayama ,  Ken Kimura ,  Hiroyuki Nakajima ,  Yasuko Ohno ,  Eiki Zidai

IPC分类号： C08G59/56 ,  C08G59/40 ,  C08G59/50 ,  C08G59/68 ,  C08K3/00 ,  C08K5/3445 ,  C08L63/00 ,  C09D163/00 ,  H01L21/58

CPC分类号： C08K3/0033 ,  C08G59/686 ,  C08K5/3445 ,  C08L63/00

摘要： A thermosetting insulating resin paste including 100 parts by weight of an epoxy resin containing a diglycidyl type liquid epoxy resin as a main component and based on the parts by weight of the epoxy resin, 0.5 to 10 parts by weight of dicyandiamide as a setting agent. It further contains 1 to 15 parts by weight of a phenoxy resin, 0.1 to 8 parts by weight of 2-phenyl-4-methyl-5-hydroxymethylimidazole and/or 2-phenyl-4,5-dihydroxymethylimidazole as a setting accelerator as well as 50 to 200 parts by weight of a thermally conductive filler. This insulating resin paste exhibits a long pot life and can be set in a short time at a low temperature without generating any voids during the setting, so that it enables the die bonding process in the production of semiconductor devices to be performed as part of the production line. It also allows a smaller device to be used in this process.

摘要翻译： 一种热固性绝缘树脂浆料，包含100重量份以二缩水甘油基型液体环氧树脂为主要成分的环氧树脂，以环氧树脂重量份为基准的0.5〜10重量份作为固化剂的双氰胺。 进一步含有1〜15重量份的苯氧基树脂，0.1〜8重量份的2-苯基-4-甲基-5-羟甲基咪唑和/或2-苯基-4,5-二羟甲基咪唑作为凝固促进剂 50〜200重量份的导热填料。 这种绝缘树脂浆料具有长的使用期限，并且可以在低温下在短时间内进行设定，而不会在凝固过程中产生任何空隙，从而使半导体器件的制造中的管芯接合工艺能够作为 生产线。 它还允许在此过程中使用较小的设备。