公开(公告)号：US08686571B2

公开(公告)日：2014-04-01

申请号：US13571260

申请日：2012-08-09

申请人： Hsin-Ting Huang ,  Jung-Huei Peng ,  Shang-Ying Tsai ,  Li-Min Hung ,  Yao-Te Huang ,  Yi-Chuan Teng ,  Chin-Yi Cho

发明人： Hsin-Ting Huang ,  Jung-Huei Peng ,  Shang-Ying Tsai ,  Li-Min Hung ,  Yao-Te Huang ,  Yi-Chuan Teng ,  Chin-Yi Cho

IPC分类号： H01L33/00 ,  H01L23/48

CPC分类号： H01L24/32 ,  H01L23/48 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2745 ,  H01L2224/27452 ,  H01L2224/27622 ,  H01L2224/29007 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29117 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/32013 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/83193 ,  H01L2224/83805 ,  H01L2224/83951 ,  H01L2924/01322 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/01032 ,  H01L2924/01029 ,  H01L2924/00

摘要： A structure comprises a first semiconductor substrate, a first bonding layer deposited on a bonding side the first semiconductor substrate, a second semiconductor substrate stacked on top of the first semiconductor substrate and a second bonding layer deposited on a bonding side of the second semiconductor substrate, wherein the first bonding layer is of a horizontal length greater than a horizontal length of the second semiconductor substrate, and wherein there is a gap between an edge of the second bonding layer and a corresponding edge of the second semiconductor substrate.

摘要翻译： 一种结构包括第一半导体衬底，沉积在第一半导体衬底的接合侧上的第一接合层，堆叠在第一半导体衬底的顶部上的第二半导体衬底和沉积在第二半导体衬底的接合侧上的第二接合层， 其中所述第一接合层的水平长度大于所述第二半导体衬底的水平长度，并且其中在所述第二接合层的边缘和所述第二半导体衬底的对应边缘之间存在间隙。

公开(公告)号：US20090126244A1

公开(公告)日：2009-05-21

申请号：US12113949

申请日：2008-05-02

申请人： Chung-Ming Hu ,  Shu-Hua Hu ,  Yi-Chuan Teng

发明人： Chung-Ming Hu ,  Shu-Hua Hu ,  Yi-Chuan Teng

IPC分类号： G09F15/00

CPC分类号： H04N9/12 ,  G06F1/1601

摘要： Disclosed is a planar display assembled and supported through components by making use of adhesive, mainly comprising: a transparent protection board, a display element, and an adhesive. Wherein, said display element is used as a photoelectric element (for example, an LC panel or a backlight module) forming a display. Said display elements can be glued and attached onto said transparent protection board by means of said adhesive such as Velcro, so as to reduce ordinary support elements utilized, thus significantly reducing the volume and weight of said planar display.

摘要翻译： 公开了通过使用粘合剂组装和支撑通过部件的平面显示器，主要包括：透明保护板，显示元件和粘合剂。 其中，所述显示元件用作形成显示器的光电元件（例如，LC面板或背光模块）。 所述显示元件可以通过诸如魔术贴之类的粘合剂粘合并附着到所述透明保护板上，以便减少所使用的普通支撑元件，从而显着地减小了所述平面显示器的体积和重量。

公开(公告)号：US06349142B1

公开(公告)日：2002-02-19

申请号：US09412576

申请日：1999-10-05

申请人： Yi-Chuan Teng

发明人： Yi-Chuan Teng

IPC分类号： H04R2500

CPC分类号： G10K9/15

摘要： A structure of speaker for ship having a base seat, a vibration board connected to a vibration shaft, and a coil seat containing a coil, characterized in that a coil housing enclosing an iron block therein, being made from iron is mounted in between the base seat and the coil seat so as to obtain the effect of magnetism concentration, the magnetism is formed when a current is passed through the coil and the magnetism is concentrated at the iron block which in turn attracts the vibration shaft to move downward, and drives, the vibration board to produce vibration, which produce sound.

摘要翻译： 一种用于具有基座的扬声器结构，与振动轴连接的振动板和包含线圈的线圈座，其特征在于，由铁制成的将铁块包围在其中的线圈壳体安装在基座 座椅和线圈座，以获得磁集中的作用，当电流通过线圈时形成磁性，并且磁性集中在铁块上，铁块又吸引振动轴向下移动， 振动板产生振动，产生声音。

公开(公告)号：US20140294216A1

公开(公告)日：2014-10-02

申请号：US13851183

申请日：2013-03-27

申请人： YI-CHUAN TENG

发明人： YI-CHUAN TENG

IPC分类号： H04R1/02

CPC分类号： H04R1/02 ,  H04R1/025 ,  H04R1/2811

摘要： The present invention relates to a waterproof speaker use on ship, which also includes a screw and a nut used to combine a vibration board, a first rubber pad, a base seat, a connection board, and a top cover combining with a housing into a unit. The present invention is characterized in that a second rubber pad is provided between the vibration board and the top cover, which can seal the gap between the housing and the top cover that prevents from water leaking into the speaker perfectly.

摘要翻译： 本发明涉及一种船用防水扬声器用途，其还包括用于将振动板，第一橡胶垫，基座，连接板和与壳体结合的顶盖组合的螺钉和螺母， 单元。 本发明的特征在于，第二橡胶垫设置在振动板和顶盖之间，其可以密封壳体和顶盖之间的间隙，防止水泄漏到扬声器中。

公开(公告)号：US20140042625A1

公开(公告)日：2014-02-13

申请号：US13571260

申请日：2012-08-09

申请人： Hsin-Ting Huang ,  Jung-Huei Peng ,  Shang-Ying Tsai ,  Li-Min Hung ,  Yao-Te Huang ,  Yi-Chuan Teng ,  Chin-Yi Cho

发明人： Hsin-Ting Huang ,  Jung-Huei Peng ,  Shang-Ying Tsai ,  Li-Min Hung ,  Yao-Te Huang ,  Yi-Chuan Teng ,  Chin-Yi Cho

IPC分类号： H01L23/48 ,  H01L21/762

CPC分类号： H01L24/32 ,  H01L23/48 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2745 ,  H01L2224/27452 ,  H01L2224/27622 ,  H01L2224/29007 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29117 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/32013 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/83193 ,  H01L2224/83805 ,  H01L2224/83951 ,  H01L2924/01322 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/01032 ,  H01L2924/01029 ,  H01L2924/00

摘要： A structure comprises a first semiconductor substrate, a first bonding layer deposited on a bonding side the first semiconductor substrate, a second semiconductor substrate stacked on top of the first semiconductor substrate and a second bonding layer deposited on a bonding side of the second semiconductor substrate, wherein the first bonding layer is of a horizontal length greater than a horizontal length of the second semiconductor substrate, and wherein there is a gap between an edge of the second bonding layer and a corresponding edge of the second semiconductor substrate.

摘要翻译： 一种结构包括第一半导体衬底，沉积在第一半导体衬底的接合侧上的第一接合层，堆叠在第一半导体衬底的顶部上的第二半导体衬底和沉积在第二半导体衬底的接合侧上的第二接合层， 其中所述第一接合层的水平长度大于所述第二半导体衬底的水平长度，并且其中在所述第二接合层的边缘和所述第二半导体衬底的对应边缘之间存在间隙。