公开(公告)号：US06072899A

公开(公告)日：2000-06-06

申请号：US12739

申请日：1998-01-23

申请人： Yoko Irie ,  Hideaki Doi ,  Hiroya Koshishiba ,  Mineo Nomoto

发明人： Yoko Irie ,  Hideaki Doi ,  Hiroya Koshishiba ,  Mineo Nomoto

IPC分类号： G01B11/24 ,  G06T1/00 ,  G06T7/00 ,  H05K3/00 ,  H05K3/06 ,  G06K9/00

CPC分类号： G01B11/24 ,  G06T7/0008 ,  G06T2207/10028 ,  G06T2207/10064 ,  G06T2207/30141

摘要： A three-dimensional shaped defect inspecting method including a three-dimensional shape detection region selecting step for detecting a two-dimensional picture signal by taking a two-dimensional optical picture fluorescence emitted from a detection object and selecting a three-dimensional shape detection region in respect of the detection object based on the detected two-dimensional picture signal, and a three-dimensional shape determining step for detecting a picture signal by taking an optical picture in accordance with a height by reflected light from the detection object and sampling height information with a desired two-dimensional pixel size in respect of the selected three-dimensional shape inspection region with respect to the detected picture signal, thereby calculating and determining a three-dimensional shape, whereby a defect caused by a deficiency in thickness or the like on a wiring pattern of a solid shape, formed on a detection object of a circuit board or the like, can be detected in a short period of time, and its device.

摘要翻译： 一种三维形缺陷检查方法，包括：三维形状检测区域选择步骤，用于通过从检测对象发出的二维光学图像荧光检测二维图像信号，并选择三维形状检测区域 基于检测到的二维图像信号对检测对象的尊重;以及三维形状确定步骤，用于通过根据来自检测对象的反射光和高度信息采集光学图像来检测图像信号，并且具有采样高度信息 相对于检测到的图像信号，对于所选择的三维形状检查区域的期望的二维像素尺寸，由此计算和确定三维形状，由此由于厚度等不足导致的缺陷 可以形成在电路板等的检测对象上的实心形状的布线图案 在短时间内被检测到，其设备。

公开(公告)号：US5930382A

公开(公告)日：1999-07-27

申请号：US645475

申请日：1996-05-13

申请人： Yoko Irie ,  Hideaki Doi ,  Yasuhiko Hara ,  Tadashi Iida ,  Yasuhiro Fujishita ,  Yasuo Nakagawa ,  Takanori Ninomiya

发明人： Yoko Irie ,  Hideaki Doi ,  Yasuhiko Hara ,  Tadashi Iida ,  Yasuhiro Fujishita ,  Yasuo Nakagawa ,  Takanori Ninomiya

IPC分类号： G01N23/04 ,  G01N21/88 ,  G01N21/956 ,  G01N29/04 ,  G01R31/02 ,  G06T7/00 ,  H05K3/00 ,  G06K9/00 ,  G06K9/32 ,  G06K9/42

CPC分类号： G06T7/0004 ,  G06T2207/10116 ,  G06T2207/20044 ,  G06T2207/30141

摘要： A wiring pattern inspecting method comprises irradiating a test object provided with wiring patterns formed in a plurality of layers with x-rays, obtaining a variable-density image signal corresponding to the thickness of the wiring patterns superposed in a plurality of layers including superposed sections of the wiring patterns, extracting a plurality of image signals, the number of which corresponding to that of the superposed wiring patterns, from the variable-density image signal, and comparing end point information or isolated point information about the wiring patterns obtained from image signal representing a larger number of superposed wiring patterns, and branch information about the end points or the isolated points on the wiring points, obtained from the extracted image signal representing a smaller number of superposed wiring patterns to inspect the wiring patterns for defects in the wiring patterns. The wiring pattern inspecting method is carried out by a wiring pattern inspecting system.

摘要翻译： 布线图案检查方法包括用X射线照射设置有多层的布线图案的测试对象，获得与叠加在多个层中的布线图案的厚度相对应的可变密度图像信号，所述多个层包括叠加部分 布线图案，从可变密度图像信号中提取与叠加布线图案的数量相对应的多个图像信号的数量，以及比较从表示的图像信号获得的布线图案的终点信息或孤立点信息 从提取的图像信号中获得的表示较少数量的叠加布线图案以检查布线图案中的布线图案中的缺陷的叠加布线图案的数量以及关于布线点上的端点或隔离点的分支信息。 布线图形检查方法由布线图形检查系统进行。