公开(公告)号：US20150310963A1

公开(公告)日：2015-10-29

申请号：US14264545

申请日：2014-04-29

申请人： ROGER G. MARKHAM ,  Ronald Steven Cok ,  Yoncai Wang ,  Mitchell Lawrence Wright

发明人： ROGER G. MARKHAM ,  Ronald Steven Cok ,  Yoncai Wang ,  Mitchell Lawrence Wright

IPC分类号： H01B5/02 ,  C23C18/48 ,  H01B19/04 ,  H01B1/02 ,  H01B1/22 ,  C23C18/38 ,  C23C18/31

CPC分类号： H01B19/04 ,  H01B1/02 ,  H01B1/22 ,  H05K1/097 ,  H05K3/1258 ,  H05K3/246 ,  H05K2203/072

摘要： A method of making a thin-film multi-layer micro-wire structure includes providing a substrate and a layer on the substrate with one or more micro-channels having a width less than or equal to 20 microns. A conductive material including silver nano-particles and having a percent ratio of silver that is greater than or equal to 40% by weight is located in the micro-channels and cured to form an electrically conductive micro-wire. The electrically conductive micro-wire has a width less than or equal to 20 microns and a depth less than or equal to 20 microns. Each micro-wire is electrolessly plated to form a plated layer located at least partially within each micro-channel between the micro-wire and the layer surface in electrical contact with the micro-wire. The plated layer has a thickness less than a thickness of the micro-wire so that the micro-wire and plated layer form the thin-film multi-layer micro-wire.

摘要翻译： 制造薄膜多层微线结构的方法包括在衬底上提供具有宽度小于或等于20微米的一个或多个微通道的衬底和层。 包含银纳米颗粒并且具有大于或等于40重量％的银百分比的导电材料位于微通道中并固化以形成导电微线。 导电微线的宽度小于或等于20微米，深度小于或等于20微米。 每个微线被无电镀以形成至少部分地位于微线和层表面之间的每个微通道中的电镀层，其与微线电接触。 电镀层的厚度小于微线的厚度，使得微线和镀层形成薄膜多层微线。