公开(公告)号：US07026383B2

公开(公告)日：2006-04-11

申请号：US10607519

申请日：2003-06-27

申请人： Masahiro Sawada ,  Yoshimasa Ogou

发明人： Masahiro Sawada ,  Yoshimasa Ogou

IPC分类号： C08K5/11 ,  C08L77/00

CPC分类号： C08K5/098 ,  C08L77/00

摘要： A polyamide resin composition comprises a polyamide resin component (A) and a metallic soap component (B), wherein the polyamide resin component (A) comprises a dicarboxylic acid component (a-1), which comprises a terephthalic acid component and an aromatic dicarboxylic acid component other than the terephthalic acid component and/or an aliphatic dicarboxylic acid component of 4 to 20 carbon atoms, and a diamine component (a-2), which comprises an aliphatic diamine component; and the metallic soap component (B) comprises a metallic soap comprising an aliphatic carboxylic acid and a monovalent or divalent metal salt The polyamide resin composition has excellent heat resistance and is favorably used as a molding material for electric or electronic parts and automotive parts. The polyamide resin composition is excellent in flowability, mold-releasing properties and shot stability in the injection molding process.

摘要翻译： 聚酰胺树脂组合物包含聚酰胺树脂组分（A）和金属皂组分（B），其中聚酰胺树脂组分（A）包含二羧酸组分（a-1），其包含对苯二甲酸组分和芳族二羧酸 含有4-20个碳原子的对苯二酸成分和/或脂肪族二羧酸成分以外的酸成分和含有脂肪族二胺成分的二胺成分（a-2） 金属皂成分（B）含有包含脂肪族羧酸和一价或二价金属盐的金属皂。聚酰胺树脂组合物具有优异的耐热性，有利地用作电气或电子部件和汽车部件的成型材料。 聚酰胺树脂组合物在注射成型工艺中流动性，脱模性和喷丸稳定性优异。