公开(公告)号：US06736945B2

公开(公告)日：2004-05-18

申请号：US09791840

申请日：2001-02-26

申请人： Hirofumi Ishida ,  Yoshiyuki Harima

发明人： Hirofumi Ishida ,  Yoshiyuki Harima

IPC分类号： C25D1700

CPC分类号： C25D17/001 ,  C25D17/06 ,  H01L21/288

摘要： A wafer plating apparatus includes a wafer clamp for holding a wafer, a wafer support member for supporting the peripheral edge of the surface to be plated, and a plating tank which circulates a plating solution while making the plating solution overflow from an upper opening of the tank. The wafer plating apparatus is arranged to perform plating, while the surface to be plated is laid face down, being in contact with the surface of the plating solution, in a state in which the wafer is clamped by the wafer clamp and the wafer support member. The wafer support member is equipped with air-vent grooves for discharging the air which remains on the peripheral edge of the surface to be plated while the surface of the plating solution and the wafer make contact. The air-vent grooves are formed at the lower end of the wafer support portion.

摘要翻译： 晶片电镀装置包括用于保持晶片的晶片夹持器，用于支撑待镀表面的周缘的晶片支撑构件，以及在使电镀液从电镀液的上部开口溢出的同时使电镀液循环的电镀槽 坦克。 晶片电镀装置被布置成进行电镀，同时在晶片被晶片夹持器和晶片支撑构件夹持的状态下，被镀表面被放置在与电镀液表面接触的状态下 。 晶片支撑构件配备有排气槽，用于在电镀液和晶片的表面接触的同时排出残留在待镀表面的周缘上的空气。 排气槽形成在晶片支撑部分的下端。

公开(公告)号：US06634370B2

公开(公告)日：2003-10-21

申请号：US09849276

申请日：2001-05-07

申请人： Satoshi Nakashima ,  Wataru Okase ,  Takenobu Matsuo ,  Tameyasu Hyakuzuka ,  Yasushi Yagi ,  Yoshiyuki Harima ,  Jun Yamauchi ,  Hiroki Taniyama ,  Kyungho Park ,  Yoshitsugu Tanaka ,  Yoshinori Kato ,  Hiroshi Sato

发明人： Satoshi Nakashima ,  Wataru Okase ,  Takenobu Matsuo ,  Tameyasu Hyakuzuka ,  Yasushi Yagi ,  Yoshiyuki Harima ,  Jun Yamauchi ,  Hiroki Taniyama ,  Kyungho Park ,  Yoshitsugu Tanaka ,  Yoshinori Kato ,  Hiroshi Sato

IPC分类号： B08B300

CPC分类号： H01L21/67167 ,  C25D7/123 ,  C25D17/001 ,  H01L21/67178 ,  H01L21/6723 ,  H01L21/68707

摘要： Liquid treatment units are disposed in multi-tiers surrounding a main-arm 35. Among liquid treatment units, plating units M1 through M4 are disposed on a lower tier side, and a unit for post-treatment process such as a cleaning unit 70 where a cleaner atmosphere is necessary is disposed on an upper tier side. Thereby, an improvement in an area efficiency and the formation and maintenance of a clean atmosphere can be simultaneously obtained.

摘要翻译： 液体处理单元设置在主臂35周围的多层中。在液体处理单元中，电镀单元M1至M4设置在下层侧，以及用于后处理处理的单元，例如清洁单元70，其中 更清洁的气氛被设置在上层侧。 由此，可以同时获得面积效率的提高，清洁气氛的形成和维护。

公开(公告)号：US5971696A

公开(公告)日：1999-10-26

申请号：US937593

申请日：1997-09-29

申请人： Tamio Endo ,  Yoshiyuki Harima

发明人： Tamio Endo ,  Yoshiyuki Harima

IPC分类号： B65G49/07 ,  H01L21/677 ,  B65G21/00

CPC分类号： H01L21/67781 ,  Y10S414/136 ,  Y10S414/14

摘要： There is provided a cassette carrying-in system, which can rotate a cassette housing therein substrates to be treated so that the substrates are changed from a vertical state to a horizontal state and which can carry the cassette in, e.g., a load-lock chamber of a vacuum processing unit. The cassette carrying-in system is provided for carrying a cassette, in which a plurality of substrates to be processed are arranged in parallel, in a processing unit for treating the substrates. The cassette carrying-in system comprises: a moving body having a first supporting portion for holding a bottom portion of the cassette so that the substrates to be processed are arranged vertically, and a second supporting portion, which is rotatable with the first supporting portion and which supports thereon a side of the cassette when the cassette is inclined, the second supporting portion supporting thereon the side serving as a bottom of the cassette when the substrates to be processed are arranged horizontally; a rotating mechanism for rotating the first and second supporting portions so that the substrates in the cassette are changed between a vertical state and a horizontal state; and a running mechanism for running the moving body so that the cassette supported on the first and second supporting portions moves between inside and outside the processing unit.

摘要翻译： 提供了一种盒式磁带进入系统，其可以将待处理的基板中的盒壳旋转，使得基板从垂直状态改变到水平状态，并且可以将盒携带在例如装载锁定室 的真空处理单元。 盒式磁带进入系统被提供用于在用于处理基板的处理单元中携带其中待处理的多个基板并联布置的盒。 盒式录入系统包括：移动体，具有用于保持盒的底部的第一支撑部分，使得待处理的基板垂直布置;以及第二支撑部分，其可与第一支撑部分一起旋转;以及第二支撑部分， 当所述盒子倾斜时，所述第二支撑部分在所述盒子的一侧支撑在所述盒子的一侧，当所述被处理基板水平布置时，所述第二支撑部分在所述盒子的底部支撑在所述盒子的底部; 旋转机构，用于旋转第一和第二支撑部分，使得盒中的基板在垂直状态和水平状态之间改变; 以及用于使运动体运行的运行机构，使得支撑在第一和第二支撑部分上的盒在处理单元的内部和外部之间移动。

公开(公告)号：US5048164A

公开(公告)日：1991-09-17

申请号：US564318

申请日：1990-08-08

申请人： Yoshiyuki Harima

发明人： Yoshiyuki Harima

IPC分类号： H01L21/00 ,  H01L21/205 ,  H01L21/677

CPC分类号： H01L21/67748 ,  H01L21/67115 ,  H01L21/67757 ,  H01L21/67781 ,  Y10S414/14 ,  Y10T29/41

摘要： A vertical heat treatment apparatus heat-treats wafers horizontally carried in a boat while keeping the boat vertical in a reaction tube. The apparatus includes a system for transferring the wafers between the boat and wafer carriers, a system for loading and unloading the wafer-carried boat into and out of the reaction tube, and a system for waiting the boat in which not-treated wafers are carried. An arm is provided to move the boat while supporting the boat vertically. The boat is moved by the arm among a first position where the wafer transferring system is located, a second position where the load and unload system is located and a third position where the boat waiting system is located. A system for engaging with the top of the boat is further located at the first position to fix the top of the boat when the wafers are transferred to and out of the boat by the wafer transfer system.

摘要翻译： 立式热处理装置对船上水平承载的晶片进行热处理，同时使船垂直于反应管。 该装置包括用于在船和晶片载体之间传送晶片的系统，用于将载有晶片的船载入和卸载反应管的系统，以及用于等待未处理的晶片的船的等待系统 。 提供一个手臂来移动船，同时垂直地支撑船。 船在臂之间移动到晶片转移系统所在的第一位置，负载和卸载系统所在的第二位置以及船等待系统所在的第三位置。 当晶片通过晶片传送系统传送到和离开船只时，用于与船的顶部接合的系统进一步位于第一位置以固定船的顶部。