公开(公告)号：US5000047A

公开(公告)日：1991-03-19

申请号：US316647

申请日：1989-02-28

申请人： Yukihiro Kato ,  Masahiro Asai ,  Yosihumi Watanabe ,  Tomohiro Watanabe

发明人： Yukihiro Kato ,  Masahiro Asai ,  Yosihumi Watanabe ,  Tomohiro Watanabe

IPC分类号： G01L9/00

CPC分类号： G01L19/003 ,  G01L19/0084 ,  G01L19/0645 ,  G01L19/143

摘要： This pressure sensor comprises a housing having a cavity at at least one end portion thereof, a pressure detecting element provided with the cavity and generating an electric signal corresponding to the pressure detected, a transmitter for transmitting the signal to the outside of the housing, and hermetically sealed with one end thereof connected to the pressure detecting element, a sealed medium provided within the cavity to prevent deterioration of the pressure detecting element, a diaphragm provided to cover the surface of the cavity, and a sealing element for sealing the sealed medium within the cavity and provided in a portion connected to the cavity of the housing, and further, a sealing ability of either the hermetic seal portion of the transmitter or of the sealing element is improved by utilizing a back pressure of a pressure medium. The sealing ability is improved by either making both surfaces of a diaphragm and of a sealing element form a common surface of the housing, by forming a grooved portion surrounding the hermetic terminal, or by attenuating the diameter of the top end portion of the housing. Leakage of the sealing liquid from the hermetic terminal or the sealing element is thus effectively prevented, and the reliability of the mechanical strength of the connecting portion of the housing and the device on which the housing is installed is improved, and thus a high reliability semiconductor pressure sensor to be used for detecting the pressure of a high pressure medium can be obtained.

摘要翻译： 该压力传感器包括在其至少一个端部处具有空腔的壳体，设置有空腔并产生对应于所检测的压力的电信号的压力检测元件，用于将信号传输到壳体的外部的发射器，以及 气密密封，其一端连接到压力检测元件，密封介质，设置在腔内以防止压力检测元件的劣化，设置成覆盖空腔表面的隔膜;以及用于密封密封介质的密封元件 并且设置在与壳体的空腔相连的部分中，并且通过利用压力介质的背压来改善发射器或密封元件的气密密封部分的密封能力。 通过将隔膜的两个表面和密封元件形成外壳的共同表面，通过形成围绕密封端子的开槽部分，或者通过减小外壳的顶端部分的直径来提高密封能力。 因此，能够有效地防止来自密封端子或密封元件的密封液的泄漏，并且壳体的连接部和安装壳体的装置的机械强度的可靠性提高，因此高可靠性半导体 可以获得用于检测高压介质的压力的压力传感器。