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公开(公告)号：US12072256B2
公开(公告)日：2024-08-27
申请号：US17639167
申请日：2020-08-28
申请人： TDK CORPORATION
发明人： Masanori Kobayashi , Ken Unno , Tetsuya Sasahara , Kohei Nawaoka
CPC分类号： G01L19/147 , G01L9/04 , G01L9/0047 , G01L9/0048 , G01L9/0055 , G01L19/143
摘要： A sensor element suitable for miniaturization. This pressure sensor element has: a metal plate; an insulating film provided on a first surface, which is one surface of the metal plate, so as to form a covered region in which the first plate is covered and an exposed region in which the first surface is exposed; and a pressure detection circuit formed on the insulating film so as to be insulated from the first surface by means of the insulating film.
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公开(公告)号：US12050144B2
公开(公告)日：2024-07-30
申请号：US17635066
申请日：2020-08-12
申请人： Danfoss A/S
发明人： Mohamed Benslimane
CPC分类号： G01L19/0092 , G01K13/02 , G01L9/0041 , G01L19/0038 , G01L19/0084 , G01L19/143 , G01L9/06 , G01L9/08
摘要： A sensor arrangement for measuring the pressure and temperature of a fluid includes a housing, a pressure sensor element, and a temperature sensor case. The housing includes a passage and a fluid opening, the passage and the fluid opening being in fluid communication. The pressure sensor element is connected to the housing, the pressure sensor element being in fluid communication with the passage. The temperature sensor case includes at least one temperature sensor element, the temperature sensor case being at least partially arranged in the passage. The sensor arrangement further includes an attachment element, wherein the attachment element attaches the temperature sensor case to the passage. The sensor arrangement further includes a fluid channel extending at least in part between the housing and the temperature sensor case, the fluid channel passing the attachment element and being in fluid communication with the fluid opening and the pressure sensor element.
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公开(公告)号：US20180346322A1
公开(公告)日：2018-12-06
申请号：US15989259
申请日：2018-05-25
申请人： ROHM CO., LTD.
发明人： Masahiro SAKURAGI
CPC分类号： B81C1/00047 , B81B3/0021 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81B2207/012 , B81C2201/0116 , B81C2201/053 , G01L19/0069 , G01L19/143
摘要： A method for manufacturing a MEMS device includes a hole forming step of forming a plurality of holes concaved from a principal surface in a substrate material including a semiconductor, a connecting-hollow-portion forming step of forming a connecting hollow portion that connects the plurality of holes together, and a movable-portion forming step of, by partially moving the semiconductor of the substrate material so as to close at least one part of the plurality of holes, forming a hollow portion that exists inside the substrate material and a movable portion that coincides with the hollow portion when viewed in a thickness direction of the substrate material.
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公开(公告)号：US10018526B2
公开(公告)日：2018-07-10
申请号：US15119459
申请日：2015-02-17
申请人： Robert Bosch GmbH
CPC分类号： G01L19/0061 , B60T8/3675 , G01D11/24 , G01D11/30 , G01L9/0055 , G01L19/0084 , G01L19/14 , G01L19/142 , G01L19/143 , G01L19/147 , G01L19/148
摘要： A connection device for a pressure sensor includes a supporting unit and a circuit board. The circuit board carries an electronic circuit having at least one of at least one electronic component and at least one electrical component. The supporting unit includes a multi-part main body that is electrically and mechanically connected to the circuit board via at least one soldered connection. The supporting unit further forms an external interface having at least one electrical contact point that enables tapping of at least one electrical output signal of the electronic circuit, and that is electrically connected to a corresponding contact point of the circuit board via an electrical connection. A pressure sensor includes such a connection device, and a method pertains to producing such a connection device.
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公开(公告)号：US10006822B2
公开(公告)日：2018-06-26
申请号：US15628758
申请日：2017-06-21
发明人： Jian Chen , Laurent Otte
CPC分类号： G01L9/0055 , G01L9/0042 , G01L19/0069 , G01L19/0084 , G01L19/06 , G01L19/0627 , G01L19/143 , H01L29/84 , H01L2224/05554 , H01L2224/06 , H01L2224/48137 , H01L2224/48145 , H01L2224/48247 , H01L2224/48465 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor sensor assembly for use in a corrosive environment comprises a processing device comprising at least one first bondpad of a material which may be corroded by a corrosive component in a corrosive environment; a sensor device comprising at least one second bondpad consisting of and/or being covered by a first corrosion resistant material; at least one bonding wire for making a signal connection between the at least one first bondpad of the processing device and the second bondpad of the sensor device. The processing device is partially overmoulded by a second corrosion resistant material, and is partially exposed to a cavity in the corrosion resistant material, with the sensor device being present in the cavity. A redistribution layer is provided to enable signal connection between the processing device and the sensor device is physically made in the cavity while the second corrosion resistant material covers the first bondpad.
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公开(公告)号：US20180149539A1
公开(公告)日：2018-05-31
申请号：US15820537
申请日：2017-11-22
IPC分类号： G01L19/14
CPC分类号： G01L19/143 , G01L19/144
摘要： A hydraulic sensor attachment structure includes an accommodating portion, a sensor case, and a lid disposed over the accommodating portion. In the hydraulic sensor attachment structure, an oil passage body includes the accommodating portion and a hydraulic pressure detection port. A hydraulic sensor includes a sensor main body, and the sensor case that covers the sensor main body. The accommodating portion includes a support portion that supports the hydraulic sensor from below. The sensor case includes a detection port portion. The accommodating portion includes a fastening portion and the lid includes a fastening portion. By fastening the fastening portion of the accommodating portion and the fastening portion of the lid by rotating the lid in one direction of the circumferential directions, the sensor case is held by the support portion and the lid in the up-down direction and is fixed to the oil passage body.
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公开(公告)号：US09976921B2
公开(公告)日：2018-05-22
申请号：US15665119
申请日：2017-07-31
申请人： Measurement Ltd.
发明人： Steven Petrucelli
CPC分类号： G01L9/0055 , G01L19/0038 , G01L19/143 , G01L19/147
摘要： A pressure sensor may comprise a socket, an upper CB, a lower CB, and a hex housing. The socket may include a plurality of co-molded electrical pin conductors extending axially from electrical connectors defined within a top end of the socket for receiving an external electrical cable to a bottom end of the socket. A top side of the upper CB may have electrical contacts configured to contact the electrical pin conductors. The lower CB may be connected to the upper CB by at least one structural member, and electrically coupled to the upper CB and to strain gauges coupled to a diaphragm. The hex housing may have an interior axial port extending from a bottom of said hex housing to a counterbore for holding the diaphragm, thereby exposing a first side of said diaphragm to the fluid within the axial port.
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公开(公告)号：US09891081B2
公开(公告)日：2018-02-13
申请号：US14758137
申请日：2013-12-19
申请人： Robert Bosch GmbH
CPC分类号： G01D11/245 , G01L19/14 , G01L19/143 , G01L19/147 , Y10T29/49828
摘要： A method for producing a sensor housing comprises forming three seals including a first annular seal and a second annular seal connected to each other by a connecting web formed materially integral in a unipartite fashion with the first annular seal and the second annular seal, and positioning the first annular seal and the second annular seal on a housing shell of the sensor housing.
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公开(公告)号：US20170350743A1
公开(公告)日：2017-12-07
申请号：US15610090
申请日：2017-05-31
发明人： Takahiro Matsuda , Jinichi Todoroki
IPC分类号： G01F23/18
CPC分类号： G01F23/18 , G01D11/245 , G01L19/143
摘要： A device includes: an outer case; an inner case; a cylindrical base having a distal end that penetrates through a cylinder of the outer case to be fixed to the outer case; and a fastener configured to be mounted on the distal end of the base, the fastener including: an exterior configured to be guided by a guide provided to the inner case; a fastener-side engaging portion engageable with the inner case; and a contact peripheral portion configured to be contact with the outer case to prevent the inner case from rotating relative to the outer case.
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公开(公告)号：US20170340814A1
公开(公告)日：2017-11-30
申请号：US15681957
申请日：2017-08-21
申请人： Medtronic, Inc.
CPC分类号： A61M5/14276 , A61M39/0208 , A61M2205/3317 , A61M2205/3331 , G01L9/0072 , G01L15/00 , G01L19/0023 , G01L19/0069 , G01L19/086 , G01L19/143 , G01L19/148 , G01L19/149
摘要： The disclosure is directed to a pressure sensor of an implantable medical device. The pressure sensor may utilize detect fluid pressure based on a changing capacitance between two capacitive elements. The pressure sensor may define at least a portion of a fluid enclosure of the IMD. In one example, the pressure sensor has a self-aligning housing shape that occludes an opening in the pump bulkhead of the IMD. An operative surface of the pressure and the portion of the fluid enclosure may be formed of a corrosion resistant and/or biocompatible material. A first capacitive element of the pressure sensor may be a metal alloy diaphragm that deflects in response to external fluid pressure. A second capacitive element of the pressure sensor may be a metal coating on a rigid insulator sealed from the fluid by the diaphragm and a housing of the sensor.
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