公开(公告)号：US20120320496A1

公开(公告)日：2012-12-20

申请号：US13494544

申请日：2012-06-12

申请人： Jong Beom Shin ,  Hyun Woo Kim ,  Doo Young Kim ,  Hyung Kyu Shim ,  Hyun Kyu Im ,  Youn Sik Jin ,  Dong Gun Kim

发明人： Jong Beom Shin ,  Hyun Woo Kim ,  Doo Young Kim ,  Hyung Kyu Shim ,  Hyun Kyu Im ,  Youn Sik Jin ,  Dong Gun Kim

IPC分类号： H01G4/12

CPC分类号： H01G4/30 ,  H01G4/005 ,  H01G4/12

摘要： Disclosed herein are a stacked chip device including: a stacked body in which a plurality of sheets having an internal electrode made of a conductive material are stacked; external electrodes provided at both sides of the stacked body; and connection electrodes extending from the internal electrode and electrically connecting the internal electrode with the external electrodes, wherein the connection electrodes include: a plating solution permeation preventing section extending from the internal electrode, however, extending with a thickness smaller than the thickness of the internal electrode; and a contact reinforcement section extending from the plating solution permeation preventing section, however, extending in the form in which the thickness thereof is gradually extended toward the external electrode, and a manufacturing method thereof.

摘要翻译： 这里公开了一种堆叠式芯片装置，包括：层叠体，其中堆叠具有由导电材料制成的内部电极的多个片材; 设置在层叠体的两侧的外部电极; 以及从内部电极延伸并将内部电极与外部电极电连接的连接电极，其中，连接电极包括：从内部电极延伸的电镀液渗透防止部，其厚度比内部电极的厚度 电极; 以及从电镀液渗透防止部延伸的接触加强部，其厚度以其厚度逐渐向外部电极延伸的形态及其制造方法延伸。

公开(公告)号：US08675342B2

公开(公告)日：2014-03-18

申请号：US13494544

申请日：2012-06-12

申请人： Jong Beom Shin ,  Hyun Woo Kim ,  Doo Young Kim ,  Hyung Kyu Shim ,  Hyun Kyu Im ,  Youn Sik Jin ,  Dong Gun Kim

发明人： Jong Beom Shin ,  Hyun Woo Kim ,  Doo Young Kim ,  Hyung Kyu Shim ,  Hyun Kyu Im ,  Youn Sik Jin ,  Dong Gun Kim

IPC分类号： H01G4/06

CPC分类号： H01G4/30 ,  H01G4/005 ,  H01G4/12

摘要： Disclosed herein are a stacked chip device including: a stacked body in which a plurality of sheets having an internal electrode made of a conductive material are stacked; external electrodes provided at both sides of the stacked body; and connection electrodes extending from the internal electrode and electrically connecting the internal electrode with the external electrodes, wherein the connection electrodes include: a plating solution permeation preventing section extending from the internal electrode, however, extending with a thickness smaller than the thickness of the internal electrode; and a contact reinforcement section extending from the plating solution permeation preventing section, however, extending in the form in which the thickness thereof is gradually extended toward the external electrode, and a manufacturing method thereof.

摘要翻译： 这里公开了一种堆叠式芯片装置，包括：层叠体，其中堆叠具有由导电材料制成的内部电极的多个片材; 设置在层叠体的两侧的外部电极; 以及从内部电极延伸并将内部电极与外部电极电连接的连接电极，其中，连接电极包括：从内部电极延伸的电镀液渗透防止部，其厚度比内部电极的厚度 电极; 以及从电镀液渗透防止部延伸的接触加强部，其厚度以其厚度逐渐向外部电极延伸的形态及其制造方法延伸。