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公开(公告)号:US20130109140A1
公开(公告)日:2013-05-02
申请号:US13414898
申请日:2012-03-08
申请人: Chun-Li Chou , Shao-Yen Ku , Chi-Yun Tseng , Yu-Yen Hsu , Tsai-Pao Su , Hobin Chen , Sheng-Chi Shih
发明人: Chun-Li Chou , Shao-Yen Ku , Chi-Yun Tseng , Yu-Yen Hsu , Tsai-Pao Su , Hobin Chen , Sheng-Chi Shih
IPC分类号: H01L21/336
CPC分类号: H01L21/823412 , H01L21/02057 , H01L21/30608 , H01L21/67017 , H01L21/6708 , H01L21/823425 , H01L29/165 , H01L29/66575 , H01L29/66628 , H01L29/66636 , H01L29/7834 , H01L29/7848
摘要: A system and method for etching a substrate is provided. An embodiment comprises utilizing an inert carrier gas in order to introduce a liquid etchant to a substrate. The inert carrier gas may prevent undesirable chemical reactions from taking place during the etching process, thereby helping to reduce the number of defects that occur to the substrate and other structures during the etching process.
摘要翻译: 提供了蚀刻基板的系统和方法。 一个实施方案包括使用惰性载气以将液体蚀刻剂引入基底。 惰性载气可以防止在蚀刻过程期间发生不期望的化学反应,从而有助于减少在蚀刻过程期间对基底和其它结构发生的缺陷的数量。
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公开(公告)号:US09263337B2
公开(公告)日:2016-02-16
申请号:US13414898
申请日:2012-03-08
申请人: Chun-Li Chou , Shao-Yen Ku , Chi-Yun Tseng , Yu-Yen Hsu , Tsai-Pao Su , Hobin Chen , Sheng-Chi Shih
发明人: Chun-Li Chou , Shao-Yen Ku , Chi-Yun Tseng , Yu-Yen Hsu , Tsai-Pao Su , Hobin Chen , Sheng-Chi Shih
IPC分类号: H01L21/8238 , H01L21/8234 , H01L29/78 , H01L29/66 , H01L29/165 , H01L21/02 , H01L21/306 , H01L21/67
CPC分类号: H01L21/823412 , H01L21/02057 , H01L21/30608 , H01L21/67017 , H01L21/6708 , H01L21/823425 , H01L29/165 , H01L29/66575 , H01L29/66628 , H01L29/66636 , H01L29/7834 , H01L29/7848
摘要: A system and method for etching a substrate is provided. An embodiment comprises utilizing an inert carrier gas in order to introduce a liquid etchant to a substrate. The inert carrier gas may prevent undesirable chemical reactions from taking place during the etching process, thereby helping to reduce the number of defects that occur to the substrate and other structures during the etching process.
摘要翻译: 提供了蚀刻基板的系统和方法。 一个实施方案包括使用惰性载气以将液体蚀刻剂引入基底。 惰性载气可以防止在蚀刻过程期间发生不期望的化学反应,从而有助于减少在蚀刻过程期间对基底和其它结构发生的缺陷的数量。
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公开(公告)号:US20070279937A1
公开(公告)日:2007-12-06
申请号:US11556369
申请日:2006-11-03
申请人: Meng-Jia Hsiao , Chih-Kuang Chen , Kuo-Tung Huang , Yu-Yen Hsu
发明人: Meng-Jia Hsiao , Chih-Kuang Chen , Kuo-Tung Huang , Yu-Yen Hsu
IPC分类号: F21V7/04
CPC分类号: G02F1/133606 , G02F1/133603 , G02F1/133608
摘要: A backlight module includes a back bezel, at least two spot light sources, and a diffuser plate. The spot light sources are disposed on the back bezel. The diffuser is disposed above the back bezel and the spot light sources. The spot light sources are disposed at different locations along the thickness of the backlight module, or optical axes of the spot light sources are not parallel.
摘要翻译: 背光模块包括后挡板,至少两个点光源和扩散板。 点光源设置在后挡板上。 扩散器设置在后挡板和聚光源上。 点光源沿着背光模块的厚度设置在不同的位置,或者聚光源的光轴不平行。
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