公开(公告)号：US20090168356A1

公开(公告)日：2009-07-02

申请号：US11964896

申请日：2007-12-27

Applicant: FEI CHEN ,  DI-QIONG ZHAO ,  YI-CHYNG FANG ,  YUE-BIN WANG

Inventor： FEI CHEN ,  DI-QIONG ZHAO ,  YI-CHYNG FANG ,  YUE-BIN WANG

IPC: H05K7/20

CPC classification number: H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A memory module assembly (100) includes a memory card (200) having a right side surface (240) and a left side surface (220), a heat sink (400) and a heat pipe (500). The heat sink includes a base member (420) attached to the left side surface of the memory card and a shell (440) attached to the right side surface of the memory card and coupled to the base member. The base member includes a substrate portion (422) attached to the left side surface of the memory card and a support portion (424) extended from the substrate portion and supported on a top edge of the memory card. The heat pipe includes an evaporator (520) in thermal engagement with one of the shell and the substrate portion and a condenser (540) in thermal engagement with the support portion.

Abstract translation: 存储模块组件（100）包括具有右侧表面（240）和左侧表面（220），散热器（400）和热管（500）的存储卡（200）。 散热器包括附接到存储卡的左侧表面的基座构件（420）和附接到存储卡的右侧表面并联接到基座构件的外壳（440）。 基座部件包括安装在存储卡的左侧表面上的基板部分（422）和从基板部分延伸并支撑在存储卡的顶部边缘上的支撑部分（424）。 热管包括与外壳和基板部分中的一个热接合的蒸发器（520）和与支撑部分热接合的冷凝器（540）。

公开(公告)号：US07755897B2

公开(公告)日：2010-07-13

申请号：US11964896

申请日：2007-12-27

Applicant: Fei Chen ,  Di-Qiong Zhao ,  Yi-Chyng Fang ,  Yue-Bin Wang

Inventor： Fei Chen ,  Di-Qiong Zhao ,  Yi-Chyng Fang ,  Yue-Bin Wang

IPC: H05K7/20 ,  H01L23/36

CPC classification number: H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A memory module assembly (100) includes a memory card (200) having a right side surface (240) and a left side surface (220), a heat sink (400) and a heat pipe (500). The heat sink includes a base member (420) attached to the left side surface of the memory card and a shell (440) attached to the right side surface of the memory card and coupled to the base member. The base member includes a substrate portion (422) attached to the left side surface of the memory card and a support portion (424) extended from the substrate portion and supported on a top edge of the memory card. The heat pipe includes an evaporator (520) in thermal engagement with one of the shell and the substrate portion and a condenser (540) in thermal engagement with the support portion.

Abstract translation: 存储模块组件（100）包括具有右侧表面（240）和左侧表面（220），散热器（400）和热管（500）的存储卡（200）。 散热器包括附接到存储卡的左侧表面的基座构件（420）和附接到存储卡的右侧表面并联接到基座构件的外壳（440）。 基座部件包括安装在存储卡的左侧表面上的基板部分（422）和从基板部分延伸并支撑在存储卡的顶部边缘上的支撑部分（424）。 热管包括与外壳和基板部分中的一个热接合的蒸发器（520）和与支撑部分热接合的冷凝器（540）。