公开(公告)号：US20100020494A1

公开(公告)日：2010-01-28

申请号：US12328778

申请日：2008-12-05

申请人： QING-LEI GUO ,  SHOU-LI ZHU ,  YI-CHYNG FANG

发明人： QING-LEI GUO ,  SHOU-LI ZHU ,  YI-CHYNG FANG

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L23/3672 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat sink and a fan. The heat sink includes a first fin assembly and two second fin assemblies located on two opposite sides of the first fin assembly respectively. The first fin assembly includes a plurality of parallel first fins arranged side by side. A first airflow channel is formed between each two neighboring first fins and communicates with a top side of the heat sink. Each of the second fin assemblies includes a plurality of parallel second fins. A second airflow channel is formed between each two neighboring second fins and communicates with the top side of the heat sink. The first fins are perpendicular to the second fins with the first airflow channels and the second airflow channels communicating with four sides of the heat sink, respectively.

摘要翻译： 散热装置包括散热器和风扇。 散热器包括分别位于第一翅片组件的两个相对侧上的第一翅片组件和两个第二翅片组件。 第一翅片组件包括并排布置的多个平行的第一翅片。 在每个相邻的第一散热片之间形成第一气流通道，并与散热器的顶侧连通。 每个第二翅片组件包括多个平行的第二翅片。 在每个相邻的第二散热片之间形成第二气流通道，并与散热片的顶侧连通。 第一散热片垂直于第二散热片，第一气流通道和第二气流通道分别与散热片的四个侧面连通。

公开(公告)号：US20090168356A1

公开(公告)日：2009-07-02

申请号：US11964896

申请日：2007-12-27

申请人： FEI CHEN ,  DI-QIONG ZHAO ,  YI-CHYNG FANG ,  YUE-BIN WANG

发明人： FEI CHEN ,  DI-QIONG ZHAO ,  YI-CHYNG FANG ,  YUE-BIN WANG

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A memory module assembly (100) includes a memory card (200) having a right side surface (240) and a left side surface (220), a heat sink (400) and a heat pipe (500). The heat sink includes a base member (420) attached to the left side surface of the memory card and a shell (440) attached to the right side surface of the memory card and coupled to the base member. The base member includes a substrate portion (422) attached to the left side surface of the memory card and a support portion (424) extended from the substrate portion and supported on a top edge of the memory card. The heat pipe includes an evaporator (520) in thermal engagement with one of the shell and the substrate portion and a condenser (540) in thermal engagement with the support portion.

摘要翻译： 存储模块组件（100）包括具有右侧表面（240）和左侧表面（220），散热器（400）和热管（500）的存储卡（200）。 散热器包括附接到存储卡的左侧表面的基座构件（420）和附接到存储卡的右侧表面并联接到基座构件的外壳（440）。 基座部件包括安装在存储卡的左侧表面上的基板部分（422）和从基板部分延伸并支撑在存储卡的顶部边缘上的支撑部分（424）。 热管包括与外壳和基板部分中的一个热接合的蒸发器（520）和与支撑部分热接合的冷凝器（540）。

公开(公告)号：US20090261707A1

公开(公告)日：2009-10-22

申请号：US12406095

申请日：2009-03-17

申请人： TAY-JIAN LIU ,  YEU-LIH LIN ,  YI-CHYNG FANG

发明人： TAY-JIAN LIU ,  YEU-LIH LIN ,  YI-CHYNG FANG

IPC分类号： H01J61/52

CPC分类号： F21V29/83 ,  F21K9/233 ,  F21V29/006 ,  F21V29/51 ,  F21V29/74 ,  F21V29/76 ,  F21Y2115/10 ,  H01L2924/0002 ,  H01L2924/00

摘要： An LED illumination device includes an optical section disposed at a bottom end of the LED illumination device, and in which a light source is provided. A heat dissipation section located adjacent to the optical section includes a plurality of fins thermally contacting the light source. The electrical section is disposed at a top end of the LED illumination device and electrically connects with the light source. The heat dissipation section is disposed between the optical section and the electrical section. The electrical section defines a plurality of air exchanges communicating the inside of the electrical section with the heat dissipation section and a plurality of exhaust ports communicating the inside of the electrical section with an external environment of the LED illumination device.

摘要翻译： LED照明装置包括设置在LED照明装置的底端的光学部，​​并且设置有光源。 位于光学部分附近的散热部包括与光源热接触的多个翅片。 电气部分设置在LED照明装置的顶端并与光源电连接。 散热部设置在光学部和电部之间。 电气部分限定了将电气部分的内部与散热部分连通的多个空气交换器和将电气部分的内部与LED照明装置的外部环境连通的多个排气口。

公开(公告)号：US06973962B2

公开(公告)日：2005-12-13

申请号：US10892641

申请日：2004-07-16

申请人： Ching-Bai Hwang ,  Yi-Chyng Fang ,  Yeu-Lih Lin

发明人： Ching-Bai Hwang ,  Yi-Chyng Fang ,  Yeu-Lih Lin

IPC分类号： H01L23/467 ,  F28F7/00

CPC分类号： H01L23/467 ,  F28F3/02 ,  F28F13/06 ,  H01L2924/0002 ,  H01L2924/00

摘要： A radiator includes a heat transfer base (30), a heat dissipation member (20) secured to the heat transfer base and a fan (50) mounted to the heat dissipation member. The heat dissipation member comprises a plurality of fins (22) for dissipation heat. Air guide structures are formed between the fins for guiding air from the fan to a middle portion of the heat transfer base and a middle bottom portion of the heat dissipation member in order to enhance heat dissipating efficiency of the radiator.

摘要翻译： 散热器包括传热基座（30），固定到传热基座的散热构件（20）和安装到散热构件的风扇（50）。 散热构件包括用于散热的多个翅片（22）。 为了提高散热器的散热效率，在翅片之间形成引导结构，用于将空气从风扇引导到传热基体的中间部分和散热构件的中部底部。

公开(公告)号：US07745967B2

公开(公告)日：2010-06-29

申请号：US11959280

申请日：2007-12-18

申请人： Qiang Zhang ,  Zhi-Ya Yang ,  Wun-Chang Shih ,  Yi-Chyng Fang

发明人： Qiang Zhang ,  Zhi-Ya Yang ,  Wun-Chang Shih ,  Yi-Chyng Fang

IPC分类号： H02K5/10 ,  H02K5/16

CPC分类号： H02K5/1675 ,  F16C2370/12 ,  H02K7/085

摘要： A cooling fan includes a fan housing (10) having a central tube (102) extending upwardly therefrom, a bearing (40) received in the central tube, a stator (20) mounted around the central tube, a rotor (30), and a cover (50). The bearing defines a bearing hole (47) therein. The rotor includes a hub (32), a plurality of blades (34) extending outwardly from the hub, and a shaft (36) extending downwardly from the hub into the bearing hole of the bearing. The cover is mounted around the shaft and arranged on the bearing to seal a top end of the bearing. The cover is made of powders by sintering and thus has a plurality of pores to generate capillary force to absorb lubricant oil leaking out of the bearing.

摘要翻译： 冷却风扇包括具有从其向上延伸的中心管（102）的风扇壳体（10），容纳在中心管中的轴承（40），围绕中心管安装的定子（20），转子（30），以及 盖（50）。 该轴承在其中限定一个轴承孔（47）。 转子包括轮毂（32），从轮毂向外延伸的多个叶片（34）和从轮毂向下延伸到轴承的轴承孔的轴（36）。 盖安装在轴上并布置在轴承上以密封轴承的顶端。 盖通过烧结由粉末制成，因此具有多个孔以产生毛细管力以吸收从轴承泄漏的润滑油。

公开(公告)号：US20060034058A1

公开(公告)日：2006-02-16

申请号：US11015984

申请日：2004-12-17

申请人： Gen-Cai Wang ,  Di-Qiong Zhao ,  Yi-Chyng Fang

发明人： Gen-Cai Wang ,  Di-Qiong Zhao ,  Yi-Chyng Fang

IPC分类号： H05K7/20

CPC分类号： H01L23/3672 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipating device includes a heat sink forming a pressing portion thereon and a clip. The heat sink includes a hollow dissipating member and a column-shaped core, and the clip includes an integrally formed body defining a round hole therein. The pressing portion extends beyond the clip and presses the body of the clip on the heat sink. The method for manufacturing the heat dissipating device as above-mentioned includes the following steps: providing a heat sink with a collar formed thereon; providing a clip on the heat sink with the collar extending beyond the clip; having the collar deformed under pressure to form a pressing portion pressing the clip on the heat sink.

公开(公告)号：US08053960B2

公开(公告)日：2011-11-08

申请号：US12406095

申请日：2009-03-17

申请人： Tay-Jian Liu ,  Yeu-Lih Lin ,  Yi-Chyng Fang

发明人： Tay-Jian Liu ,  Yeu-Lih Lin ,  Yi-Chyng Fang

IPC分类号： F21V29/00

CPC分类号： F21V29/83 ,  F21K9/233 ,  F21V29/006 ,  F21V29/51 ,  F21V29/74 ,  F21V29/76 ,  F21Y2115/10 ,  H01L2924/0002 ,  H01L2924/00

摘要： An LED illumination device includes an optical section disposed at a bottom end of the LED illumination device, and in which a light source is provided. A heat dissipation section located adjacent to the optical section includes a plurality of fins thermally contacting the light source. The electrical section is disposed at a top end of the LED illumination device and electrically connects with the light source. The heat dissipation section is disposed between the optical section and the electrical section. The electrical section defines a plurality of air exchanges communicating the inside of the electrical section with the heat dissipation section and a plurality of exhaust ports communicating the inside of the electrical section with an external environment of the LED illumination device.

摘要翻译： LED照明装置包括设置在LED照明装置的底端的光学部，​​并且设置有光源。 位于光学部分附近的散热部包括与光源热接触的多个散热片。 电气部分设置在LED照明装置的顶端并与光源电连接。 散热部设置在光学部和电部之间。 电气部分限定了将电气部分的内部与散热部分连通的多个空气交换器和将电气部分的内部与LED照明装置的外部环境连通的多个排气口。

公开(公告)号：US07755897B2

公开(公告)日：2010-07-13

申请号：US11964896

申请日：2007-12-27

申请人： Fei Chen ,  Di-Qiong Zhao ,  Yi-Chyng Fang ,  Yue-Bin Wang

发明人： Fei Chen ,  Di-Qiong Zhao ,  Yi-Chyng Fang ,  Yue-Bin Wang

IPC分类号： H05K7/20 ,  H01L23/36

CPC分类号： H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A memory module assembly (100) includes a memory card (200) having a right side surface (240) and a left side surface (220), a heat sink (400) and a heat pipe (500). The heat sink includes a base member (420) attached to the left side surface of the memory card and a shell (440) attached to the right side surface of the memory card and coupled to the base member. The base member includes a substrate portion (422) attached to the left side surface of the memory card and a support portion (424) extended from the substrate portion and supported on a top edge of the memory card. The heat pipe includes an evaporator (520) in thermal engagement with one of the shell and the substrate portion and a condenser (540) in thermal engagement with the support portion.

摘要翻译： 存储模块组件（100）包括具有右侧表面（240）和左侧表面（220），散热器（400）和热管（500）的存储卡（200）。 散热器包括附接到存储卡的左侧表面的基座构件（420）和附接到存储卡的右侧表面并联接到基座构件的外壳（440）。 基座部件包括安装在存储卡的左侧表面上的基板部分（422）和从基板部分延伸并支撑在存储卡的顶部边缘上的支撑部分（424）。 热管包括与外壳和基板部分中的一个热接合的蒸发器（520）和与支撑部分热接合的冷凝器（540）。

公开(公告)号：US20090321050A1

公开(公告)日：2009-12-31

申请号：US12417652

申请日：2009-04-03

申请人： QING-LEI GUO ,  SHOU-LI ZHU ,  YI-CHYNG FANG

发明人： QING-LEI GUO ,  SHOU-LI ZHU ,  YI-CHYNG FANG

IPC分类号： F28F7/00 ,  F28D15/00

CPC分类号： H01L23/467 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  F28F2215/04 ,  H01L21/4882 ,  H01L23/4093 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat sink and a heat pipe. The heat sink includes a first fin assembly and two second fin assemblies located on two opposite sides of the first fin assembly respectively. The heat pipe includes an evaporator section, a first condenser section and a second condenser section extending from two opposite ends of the evaporator section in the same directions, and a third condenser section extending from a free end of the second condenser section towards a free end of the first condenser section. The third condenser section extends through the first fin assembly. The first condenser section interconnects one of the second fin assemblies to the first fin assembly. The second condenser section interconnects the other second fin assembly to the first fin assembly.

摘要翻译： 散热装置包括散热器和热管。 散热器包括分别位于第一翅片组件的两个相对侧上的第一翅片组件和两个第二翅片组件。 热管包括蒸发器部分，第一冷凝器部分和第二冷凝器部分，其沿相同方向从蒸发器部分的两个相对端延伸;以及第三冷凝器部分，其从第二冷凝器部分的自由端向自由端延伸 的第一冷凝器部分。 第三冷凝器部分延伸穿过第一翅片组件。 第一冷凝器部分将第二翅片组件中的一个与第一翅片组件相互连接。 第二冷凝器部分将另一个第二翅片组件互连到第一翅片组件。

公开(公告)号：US07139171B2

公开(公告)日：2006-11-21

申请号：US11020080

申请日：2004-12-21

申请人： Gen-Cai Wang ,  Yi-Chyng Fang

发明人： Gen-Cai Wang ,  Yi-Chyng Fang

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat sink (50) and a fan (10) located above the heat sink for providing airflow. The heat sink includes a base (40) and a heat dissipating part (30) arranged on the base. The heat dissipating part includes a plurality of fins (31), each adjacent pair of the fins defines a channel (35) therebetween. The heat dissipating part defines a plurality of passages (34) disposed diagonally thereat and perpendicular to the channels. The channels and the passages are oriented consistently with the airflow of the fan.

摘要翻译： 散热装置包括散热器（50）和位于散热器上方的用于提供气流的风扇（10）。 散热器包括设置在基座上的基座（40）和散热部（30）。 散热部件包括多个翅片（31），每个相邻的翼片在它们之间限定通道（35）。 散热部分限定了多个通道（34），该通道相对于通道对角设置并垂直于通道。 通道和通道与风扇的气流一致。