公开(公告)号：US20120142885A1

公开(公告)日：2012-06-07

申请号：US13305361

申请日：2011-11-28

申请人： Yuichi Matsuki ,  Masaru Yamauchi ,  Yoshio Yoshida ,  Tadashi Hayakawa ,  Ai Takamori

发明人： Yuichi Matsuki ,  Masaru Yamauchi ,  Yoshio Yoshida ,  Tadashi Hayakawa ,  Ai Takamori

IPC分类号： C08G18/42 ,  B32B37/12

CPC分类号： C09J175/06 ,  C08G18/10 ,  C08G18/12 ,  C08G18/4018 ,  C08G18/4202 ,  C08G18/4238 ,  C08G18/4833 ,  C08G2170/20 ,  C09J175/04 ,  C08G18/307

摘要： Provided is a moisture-curing hot melt adhesive, which has superior overall performance, including heat resistance, adhesiveness, and solidification performance, and with which there is no reduction in the resulting IC card quality or productivity. Also provided is an IC card obtained by applying such a moisture-curing hot melt adhesive. The moisture-curing hot melt adhesive for an IC card comprises a urethane prepolymer (A) having a chemical structure (A1) derived from a polyester polyol (a1) that has isocyanate groups at the terminals and that is obtained by reacting of a diol and a dicarboxylic acid having 10 carbons or fewer. The moisture-curing hot melt adhesive has a shear modulus with non-moisture curing that is between (1×104) and (1×108) Pa at 40° C. and between (1×100) and (1×104) at 80° C. An IC card can be ideally produced by bonding a decorative material and a substrate using the moisture-curing hot melt adhesive.

摘要翻译： 提供了具有优异的整体性能，包括耐热性，粘合性和凝固性能的湿固化热熔粘合剂，并且不会导致所得IC卡质量或生产率的降低。 还提供了通过应用这种湿固化热熔粘合剂获得的IC卡。 用于IC卡的湿固化热熔粘合剂包括具有衍生自末端具有异氰酸酯基的聚酯多元醇（a1）的化学结构（A1）的氨基甲酸酯预聚物（A），其通过二醇和 具有10个或更少碳原子的二羧酸。 湿润固化热熔粘合剂具有非湿度固化的剪切模量，在40℃和（1×100）和（1×104）之间在（1×10 4）和（1×10 8）Pa之间 80℃。通过使用湿固化热熔粘合剂将装饰材料和基材接合，可以理想地制造IC卡。