公开(公告)号：US11562920B2

公开(公告)日：2023-01-24

申请号：US16757497

申请日：2018-10-23

Applicant: 1366 TECHNOLOGIES, INC.

Inventor： Robertus Antonius Steeman

IPC: H01L21/67 ,  H01L21/673 ,  B65G47/90 ,  H01L21/677 ,  H01L31/0352 ,  H01L31/18

Abstract: A semiconductor wafer is as wide as the industry standard width A (presently 156 mm+/−1 mm) and is longer than the industry standard A by at least 1 mm and as much as the standard equipment can reasonably accommodate, presently approximately 3-20 mm and potentially longer, thus, gaining significant additional surface area for sunlight absorption. Modules may be composed of a plurality of such larger wafers. Such wafers can be processed in conventional processing equipment that has a wafer retaining portion of industry standard size A and a configuration that also accommodates a wafer with a perpendicular second edge longer than A by at least 1 and typically 3-20 mm. Wet bench carriers and transport and inspection stations can be so used.