公开(公告)号：US20230235204A1

公开(公告)日：2023-07-27

申请号：US17927325

申请日：2021-05-21

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Adrian T. Jung ,  Boris Ove Alexander Tasch ,  Elisabeth Cura ,  Eike H. Klünker ,  Peter Bissinger ,  Wolf Steiger ,  Dirk Hasenberg

IPC: C09J163/00

CPC classification number: C09J163/00

Abstract: The present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a thermally curable resin; a thermal curing initiator for the thermally curable resin; a radiation self-polymerizable multi-functional compound comprising a polyether oligomeric backbone and at least one free-radical (co)polymerizable reactive group at each terminal position of the oligomer backbone; and a free-radical polymerization initiator for the radiation self-polymerizable multi-functional compound.