公开(公告)号：US20240227357A1

公开(公告)日：2024-07-11

申请号：US18303674

申请日：2023-04-20

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Naiyong Jing ,  Xiaoming Kou ,  Leon M. Lillie ,  Maria C. Lindsay ,  Tatsuo Fukushi ,  Steffen Vowinkel ,  Jun Chen ,  Hong Qian ,  Zai-Ming Qiu ,  Timothy A. Mertens

IPC: B32B15/08 ,  B32B15/20 ,  B32B37/06

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B37/06 ,  B32B2307/41 ,  B32B2309/025 ,  B32B2310/0831 ,  B32B2327/18 ,  B32B2457/08

Abstract: A method of bonding a substrate is described comprising providing a fluoropolymer film comprising: i) a first fluoropolymer comprising at least 80, 85, or 90 wt. % of polymerized perfluorinated monomers; ii) optionally a second fluoropolymer having a greater amount of polymerized tetrafluoroethylene than the first fluoropolymer; wherein the first fluoropolymer and/or second fluoropolymer when present comprises halogen cure sites; and iii) one or more compounds comprising an electron donor group and one or more ethylenically unsaturated groups; applying the fluoropolymer film to a substrate; and heating the fluoropolymer film to a temperature of at least 150, 160, 170, 180, 190 or 200° C.