公开(公告)号：US20170155006A1

公开(公告)日：2017-06-01

申请号：US15429649

申请日：2017-02-10

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： MARK D. WEIGEL ,  MARK A. ROEHRIG ,  SAMUEL KIDANE ,  MICHAEL D. DELMORE ,  TRACIE J. BERNIARD

IPC: H01L31/048 ,  H01L31/032 ,  H01L31/049

CPC classification number: H01L31/0481 ,  H01L31/0322 ,  H01L31/048 ,  H01L31/049 ,  Y02B10/12 ,  Y02E10/50

Abstract: The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a barrier stack adjacent the electronic device; and a weatherable sheet adjacent the barrier stack opposite the electronic device. The assembly additionally comprises a protective layer in contact with the electronic device and the weatherable sheet. The present application allows for the combination of any of the disclosed elements.