公开(公告)号：US20190265127A1

公开(公告)日：2019-08-29

申请号：US16320276

申请日：2017-06-01

Applicant: ABB K.K.

Inventor： Masaaki KITAGAWA ,  Michel FOUVET ,  Jose RODRIGUES

IPC: G01M13/00 ,  B05B3/10

Abstract: According to the present invention, an assembly suitability determination device determines suitability of assembly of a component to a paint device. The assembly suitability determination device includes an assembly suitability information recording unit, and an assembly suitability determination unit. The assembly suitability information recording unit records model information representing a model of the component and model information representing a model of a device-side component that receives the component on the paint device, and is suitable for the assembly of the component while associating the model information on the component with the model information on the device-side component. The assembly suitability determination unit determines the suitability of the assembly based on the model information on the component, the model information on the device-side component, and a recorded content of the assembly suitability information recording unit.

公开(公告)号：US20190160479A1

公开(公告)日：2019-05-30

申请号：US16321326

申请日：2017-04-17

Applicant: HITACHI SYSTEMS, LTD. ,  ABB K.K.

Inventor： Shigeru YAMAUCHI ,  Masaaki SARUYAMA ,  Masaaki KITAGAWA ,  Shinya NOMURA

IPC: B05B5/04 ,  B05B3/10

Abstract: This rotary atomizing head used in a rotary atomizing head type painting device is provided with: an atomizing head main body formed in a bell shape or a cup shape; an attachment part which is connected to the atomizing head main body and attaches the atomizing head main body to a motor rotary shaft of the rotary atomizing head type painting device; and a resin mold in which an IC tag containing unique information about the rotary atomizing head stored therein is embedded, and which is attached to the attachment part, wherein the attachment part can have a prescribed structure, the resin mold is attached to the attachment part through a prescribed method, and the IC tag is embedded in the resin mold such that the surface of an embedded coil antenna adopts a prescribed state.