公开(公告)号：US20130320896A1

公开(公告)日：2013-12-05

申请号：US13909607

申请日：2013-06-04

Applicant: ABB Oy

Inventor： Pertti SEVÄKIVI ,  Teemu Heikkilä

IPC: H05K7/20

CPC classification number: H05K7/2089 ,  H02M7/003 ,  H05K7/20918

Abstract: An arrangement for a modular inverter includes a number of power semiconductors and cooling elements, where the cooling elements are connected to the power semiconductors for cooling the power semiconductors. The power semiconductors and the cooling elements are disposed around a center axis of the arrangement in such a manner that they demark a channel around the center axis in which a cooling medium is able to flow in the direction of the center axis. The arrangement includes a first tube-shaped ring film capacitor around the center axis of the arrangement. The power semiconductors are arranged between the cooling elements and an inner surface of the first tube-shaped ring film capacitor.

Abstract translation: 模块化逆变器的装置包括多个功率半导体和冷却元件，其中冷却元件连接到用于冷却功率半导体的功率半导体。 功率半导体和冷却元件以这样的方式围绕配置的中心轴布置，使得它们绕中心轴线分开通道，在该中心轴线处冷却介质能够在中心轴线的方向上流动。 该装置包括围绕该装置的中心轴线的第一管状环形薄膜电容器。 功率半导体布置在冷却元件和第一管状环形薄膜电容器的内表面之间。