公开(公告)号：US20250126752A1

公开(公告)日：2025-04-17

申请号：US18895962

申请日：2024-09-25

Applicant: ABB Schweiz AG

Inventor： Henri Hakkarainen ,  Pauli Varsila ,  Timo Koivuluoma

IPC: H05K7/20

Abstract: A mounting tool for connecting an electronic component to a cooling surface via a thermal interface material foil. To enable simple connecting work without damaging the thermal interface material foil, the mounting tool includes: a base surface with a reception area dimensioned to receive the thermal interface material foil, spacers protruding from the base surface and notches provided at a first outer edge of the base surface at positions which are aligned with first attachment holes provided in the thermal interface material foil for allowing screws or bolts to pass through first attachment holes of the thermal interface material foil and the notches when the electric component, the thermal interface material foil and the mounting tool are in a stacked connecting position.