公开(公告)号：US20250126752A1

公开(公告)日：2025-04-17

申请号：US18895962

申请日：2024-09-25

Applicant: ABB Schweiz AG

Inventor： Henri Hakkarainen ,  Pauli Varsila ,  Timo Koivuluoma

IPC: H05K7/20

Abstract: A mounting tool for connecting an electronic component to a cooling surface via a thermal interface material foil. To enable simple connecting work without damaging the thermal interface material foil, the mounting tool includes: a base surface with a reception area dimensioned to receive the thermal interface material foil, spacers protruding from the base surface and notches provided at a first outer edge of the base surface at positions which are aligned with first attachment holes provided in the thermal interface material foil for allowing screws or bolts to pass through first attachment holes of the thermal interface material foil and the notches when the electric component, the thermal interface material foil and the mounting tool are in a stacked connecting position.

公开(公告)号：US20240280627A1

公开(公告)日：2024-08-22

申请号：US18442731

申请日：2024-02-15

Applicant: ABB Schweiz AG

Inventor： Mikko Kohvakka ,  Kari Kovanen ,  Henri Hakkarainen

IPC: G01R31/26 ,  G01R31/27

CPC classification number: G01R31/2608 ,  G01R31/27

Abstract: The present invention relates to the field of electric drive devices and arrangements comprising a plurality of power semiconductor components formed in or on a common substrate, and more particularly to an arrangement for monitoring the condition of a power semiconductor module of an electric drive device and an electric drive device. The arrangement for monitoring the condition of a power semiconductor module of an electric drive device comprises at least one pair of sensor elements, each pair comprising a first PCB copper trace sensor element and a second PCB copper trace sensor element, arranged on a printed circuit board parallel next to each other as a sensor element pair, wherein said first PCB copper trace sensor element is connected to a positive DC supply voltage source (UDC+) and said second PCB copper trace sensor element is connected to a negative DC supply voltage source (UDC−) of said electric drive device so that upon applying the DC supply voltage of said electric drive device said DC supply voltage is applied to said at least one pair of sensor elements at the same time as to the circuit components of the power semiconductor module.