公开(公告)号：US10043729B1

公开(公告)日：2018-08-07

申请号：US15428471

申请日：2017-02-09

Applicant: ABB Technology Oy

Inventor： Jorma Manninen ,  Mika Silvennoinen ,  Kjell Ingman

IPC: H01L23/34 ,  H01L23/367 ,  H01L23/492 ,  H01L21/48

Abstract: A power electronics module and a method of manufacturing a power electronics module and a base plate. The power electronics module comprising at least one power electronics component, wherein the power electronics module comprises a base plate for transferring heat generated by the at least one power electronics component to a cooling device, the base plate comprising a layered structure having a first copper layer, a second copper layer and a carbon based layer between the first and second copper layers.