LOAD FLOOR WITH ELECTRONIC COMPONENTS

    公开(公告)号:US20220234520A1

    公开(公告)日:2022-07-28

    申请号:US17614036

    申请日:2020-05-29

    摘要: A load floor assembly for a motor vehicle. The load floor assembly comprises a structural core, a first surface layer situated on a first side of the structural core, and a second surface layer situated on a second side of the structural core. The load floor assembly also includes an embedded layer positioned intermediate at least one of the first and second surface layers and the structural core. At least one electronic component is incorporated into the embedded layer, to provide a secondary functionality to the load floor assembly.

    MOLDING PROCESS FOR FORMING THERMOPLASTIC ARTICLES

    公开(公告)号:US20220258386A1

    公开(公告)日:2022-08-18

    申请号:US17627224

    申请日:2020-07-16

    IPC分类号: B29C45/00 B29C45/04 B29C45/13

    摘要: Provided is a molding system for molding a thermoplastic article. The molding system comprises a first mold half and a second mold half. The first and second mold halves together define a plurality of molding cavities in a first closed position. The plurality of cavities serve to mold a corresponding plurality of article components in a first molding stage. Subsequent the first molding stage, the first mold half is displaceable relative to the second mold half to align the plurality of article components formed during the first molding stage. During a second molding stage, the first and second mold halves are closed to a second closed position, to engage and bond together the plurality of article components into a finished thermoplastic article.