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公开(公告)号:US10209539B1
公开(公告)日:2019-02-19
申请号:US15858051
申请日:2017-12-29
Applicant: ACACIA COMMUNICATIONS, INC.
Inventor: Christopher Doerr , Long Chen , John Heanue , Momchil T. Mihnev
IPC: G02F1/01
Abstract: A method for making an apparatus, a system, and apparatus, the apparatus and system each comprising a substrate with a top side, wherein the substrate has a set of cavities in the top side of the substrate, wherein the substrate has a set of conductive elements on the top side of the substrate arranged to electrically couple with a set of conductive elements of a photonic integrated circuit (PIC), wherein each cavity of the set of cavities when coupled to the PIC creates a surface tension when exposed to an underfill to cause the underfill to flow around each cavity.
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公开(公告)号:US10268055B1
公开(公告)日:2019-04-23
申请号:US16215717
申请日:2018-12-11
Applicant: Acacia Communications, Inc.
Inventor: Christopher Doerr , Long Chen , John Heanue , Momchil T. Mihnev
IPC: G02F1/01
Abstract: A method for making an apparatus, a system, and apparatus, the apparatus and system each comprising a substrate with a top side, wherein the substrate has a set of cavities in the top side of the substrate, wherein the substrate has a set of conductive elements on the top side of the substrate arranged to electrically couple with a set of conductive elements of a photonic integrated circuit (PIC), wherein each cavity of the set of cavities when coupled to the PIC creates a surface tension when exposed to an underfill to cause the underfill to flow around each cavity.
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