公开(公告)号：US20230155053A1

公开(公告)日：2023-05-18

申请号：US18099462

申请日：2023-01-20

Applicant: Acacia Communications, Inc.

Inventor： John Heanue

IPC: H01L31/12 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/024

CPC classification number: H01L31/12 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/024

Abstract: In part, in one aspect, the disclosure relates to a system including a photonic integrated circuit (PIC) assembly, comprising a PIC comprising: a first bond pad disposed inward from an edge of the PIC a first distance; and a first wire having a first length, the first wire electrically connected to the first bond pad and extending therefrom, wherein the first distance is greater than 0.4 mm.

公开(公告)号：US10209539B1

公开(公告)日：2019-02-19

申请号：US15858051

申请日：2017-12-29

Applicant: ACACIA COMMUNICATIONS, INC.

Inventor： Christopher Doerr ,  Long Chen ,  John Heanue ,  Momchil T. Mihnev

IPC: G02F1/01

Abstract: A method for making an apparatus, a system, and apparatus, the apparatus and system each comprising a substrate with a top side, wherein the substrate has a set of cavities in the top side of the substrate, wherein the substrate has a set of conductive elements on the top side of the substrate arranged to electrically couple with a set of conductive elements of a photonic integrated circuit (PIC), wherein each cavity of the set of cavities when coupled to the PIC creates a surface tension when exposed to an underfill to cause the underfill to flow around each cavity.

公开(公告)号：US10268055B1

公开(公告)日：2019-04-23

申请号：US16215717

申请日：2018-12-11

Applicant: Acacia Communications, Inc.

Inventor： Christopher Doerr ,  Long Chen ,  John Heanue ,  Momchil T. Mihnev

IPC: G02F1/01

Abstract: A method for making an apparatus, a system, and apparatus, the apparatus and system each comprising a substrate with a top side, wherein the substrate has a set of cavities in the top side of the substrate, wherein the substrate has a set of conductive elements on the top side of the substrate arranged to electrically couple with a set of conductive elements of a photonic integrated circuit (PIC), wherein each cavity of the set of cavities when coupled to the PIC creates a surface tension when exposed to an underfill to cause the underfill to flow around each cavity.

公开(公告)号：US11563136B2

公开(公告)日：2023-01-24

申请号：US16929850

申请日：2020-07-15

Applicant: Acacia Communications, Inc.

Inventor： John Heanue

IPC: H01L31/024 ,  H01L31/12 ,  H01L31/02 ,  H01L31/0203

Abstract: In part, in one aspect, the disclosure relates to a system including a photonic integrated circuit (PIC) assembly, comprising a PIC comprising: a first bond pad disposed inward from an edge of the PIC a first distance; and a first wire having a first length, the first wire electrically connected to the first bond pad and extending therefrom, wherein the first distance is greater than 0.4 mm.

公开(公告)号：US20220020893A1

公开(公告)日：2022-01-20

申请号：US16929850

申请日：2020-07-15

Applicant: Acacia Communications, Inc.

Inventor： John Heanue

IPC: H01L31/12 ,  H01L31/0203 ,  H01L31/024 ,  H01L31/02

Abstract: In part, in one aspect, the disclosure relates to a system including a photonic integrated circuit (PIC) assembly, comprising a PIC comprising: a first bond pad disposed inward from an edge of the PIC a first distance; and a first wire having a first length, the first wire electrically connected to the first bond pad and extending therefrom, wherein the first distance is greater than 0.4 mm.