公开(公告)号：US11860415B2

公开(公告)日：2024-01-02

申请号：US17507019

申请日：2021-10-21

申请人： ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.

发明人： Shaowu Huang ,  Javier A. Delacruz ,  Liang Wang ,  Guilian Gao

IPC分类号： G02B6/13 ,  G02B6/12

CPC分类号： G02B6/13 ,  G02B2006/12061 ,  G02B2006/12097

摘要： Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects are provided. An example optical interconnect joins first and second optical conduits. A first direct oxide bond at room temperature joins outer claddings of the two optical conduits and a second direct bond joins the inner light-transmitting cores of the two conduits at an annealing temperature. The two low-temperature bonds allow photonics to coexist in an integrated circuit or microelectronics package without conventional high-temperatures detrimental to microelectronics. Direct-bonded square, rectangular, polygonal, and noncircular optical interfaces provide better matching with rectangular waveguides and better performance. Direct oxide-bonding processes can be applied to create running waveguides, photonic wires, and optical routing in an integrated circuit package or in chip-to-chip optical communications without need for conventional optical couplers. An example wafer-level process fabricates running waveguides, optical routing, and direct-bonded optical interconnects for silicon photonics and optoelectronics packages when two wafers are joined.