公开(公告)号：US12269917B2

公开(公告)日：2025-04-08

申请号：US17436498

申请日：2020-03-27

Applicant: ADEKA CORPORATION

Inventor： Shota Kobayashi ,  Ken-ichi Tamaso ,  Ryo Ogawa ,  Tamotsu Nagamatsu

IPC: C08G59/24 ,  B29C71/02 ,  C08G59/40 ,  C08G59/56 ,  C08G59/66 ,  C08G59/68 ,  C08J7/12

Abstract: Disclosed is a curable resin composition that has excellent curability by irradiation of light and heating and that is suitable for such applications as liquid encapsulants, liquid adhesives, adhesives for camera modules, and liquid crystal sealants. The curable resin composition contains (A) an aromatic epoxy resin having an allyl group, (B) a thiol-based curing agent, (C) a photoradical initiator, and (D) a thermally latent curing agent. Preferably, (A) the compound having an allyl group and an epoxy group is an aromatic epoxy resin having an allyl group. Preferably, the thiol-based curing agent, which is component (B), is in liquid form at 25° C.