公开(公告)号：US10421261B2

公开(公告)日：2019-09-24

申请号：US15547090

申请日：2016-01-26

Applicant: ADEKA CORPORATION

Inventor： Takeshi Endo ,  Kozo Matsumoto ,  Ken-ichi Tamaso ,  Chihiro Asakura ,  Ryo Ogawa

IPC: B32B27/38 ,  B32B27/26 ,  C08G59/40 ,  C08K5/5313 ,  C08L63/00 ,  C08J5/24 ,  C08K5/5398 ,  C08K5/5399 ,  C08K5/00 ,  B32B15/092 ,  C07F9/32

Abstract: A flame-retardant epoxy resin composition wherein (A) epoxy resin, (B) a curing agent and (C) a phosphorous-containing compound expressed by the following general formula (1) are contained; a prepreg using the same and a laminated plate using said prepreg; wherein m expresses an integer from 2 to 10, R1 and R2 each independently express an alkyl group or an aryl group, R3 expresses a hydrocarbon group that may contain an oxygen atom, a sulfur atom or a nitrogen atom, X expresses an oxygen atom or a sulfur atom, Y expresses an oxygen atom, a sulfur atom or —NR4—, and in this regard, R4 expresses a hydrogen atom, an alkyl group or an aryl group.

公开(公告)号：US10344191B2

公开(公告)日：2019-07-09

申请号：US15312736

申请日：2015-05-22

Applicant: DENSO CORPORATION ,  ADEKA CORPORATION

Inventor： Kenji Koga ,  Daisuke Takama ,  Ryo Ogawa ,  Shinsuke Yamada ,  Takuya Matsuda

IPC: C09J163/00 ,  C08K3/04 ,  C08K3/22 ,  C08K3/36 ,  C08G59/50 ,  C08L79/04

Abstract: Provided is a photocurable adhesive with which curing by direct irradiation of laser light is possible with almost no occurrence of surface carbonization and which is capable of satisfactory curing even when the coating thickness is increased. A photocurable adhesive, which is cured by irradiation of laser light, is provided. The curable adhesive contains an epoxy adhesive component, a light-absorbing component for thermal curing of the epoxy adhesive component by absorption of laser light, and an inorganic filler. The content of the light-absorbing component is 0.1 mass % or less. The pre-curing thermal conductivity of the photocurable adhesive is at least 0.2 W/m·K and the post-curing thermal conductivity is at least 0.5 W/m·K.

公开(公告)号：US12269917B2

公开(公告)日：2025-04-08

申请号：US17436498

申请日：2020-03-27

Applicant: ADEKA CORPORATION

Inventor： Shota Kobayashi ,  Ken-ichi Tamaso ,  Ryo Ogawa ,  Tamotsu Nagamatsu

IPC: C08G59/24 ,  B29C71/02 ,  C08G59/40 ,  C08G59/56 ,  C08G59/66 ,  C08G59/68 ,  C08J7/12

Abstract: Disclosed is a curable resin composition that has excellent curability by irradiation of light and heating and that is suitable for such applications as liquid encapsulants, liquid adhesives, adhesives for camera modules, and liquid crystal sealants. The curable resin composition contains (A) an aromatic epoxy resin having an allyl group, (B) a thiol-based curing agent, (C) a photoradical initiator, and (D) a thermally latent curing agent. Preferably, (A) the compound having an allyl group and an epoxy group is an aromatic epoxy resin having an allyl group. Preferably, the thiol-based curing agent, which is component (B), is in liquid form at 25° C.

公开(公告)号：US10253136B2

公开(公告)日：2019-04-09

申请号：US15111937

申请日：2015-01-22

Applicant: ADEKA CORPORATION

Inventor： Takeshi Endo ,  Kozo Matsumoto ,  Daisuke Sato ,  Ryo Ogawa

IPC: C08G59/50 ,  C07D233/58 ,  C07D239/06 ,  C07D249/08 ,  C07D251/14 ,  C08L63/00 ,  C07D235/06 ,  C07D235/08

Abstract: An epoxy resin composition excellent in storage stability and curability is provided. Particularly, a compound of general formula (I) and an epoxy resin composition containing the compound as a curing agent are provided. In formula (I), R1 is a hydrocarbon group optionally containing a nitrogen atom and capable of forming a cyclic structure optionally having a substituent; R2 is a hydrogen atom, an alkyl group, or an aryl group or is taken together with R1 to form an unsaturated bond; R3 is a hydrogen atom, an alkyl group, or an aryl group; and X is a dicyanamide ion or a thiocyanate ion.

公开(公告)号：US10562924B2

公开(公告)日：2020-02-18

申请号：US14900844

申请日：2014-08-21

Applicant: ADEKA CORPORATION

Inventor： Takeshi Endo ,  Kozo Matsumoto ,  Ken-ichi Tamaso ,  Ryo Ogawa

IPC: C07F9/36 ,  C07F9/32 ,  C09K21/12 ,  C09K21/14 ,  C08L63/00 ,  C08K5/5313

Abstract: The purpose of the present invention is to provide a phosphorus-containing compound having reactivity with a glycidyl group, specifically a phosphorus-containing compound represented by general formula (I). (In the formula, m represents a numerical value of 1 to 10; R1 and R2 independently represent a hydrogen atom, an alkyl group or an aryl group; R3 represents an alkyl group, an alkanediyl group, an alkanetriyl group, an alkanetetrayl group or an aromatic group; X represents an oxygen atom or a sulfur atom; Y represents an oxygen atom, a sulfur atom or —NR4—; and R4 represents a hydrogen atom, an alkyl group or an aryl group.)

公开(公告)号：US09738667B2

公开(公告)日：2017-08-22

申请号：US14915766

申请日：2014-11-10

Applicant: ADEKA CORPORATION

Inventor： Takeshi Endo ,  Kozo Matsumoto ,  Ken-ichi Tamaso ,  Ryo Ogawa

IPC: C07F9/24 ,  C07F9/22 ,  C08G59/40 ,  C08G59/44 ,  C08G59/14

CPC classification number: C07F9/242 ,  C07F9/224 ,  C07F9/2404 ,  C07F9/2458 ,  C08G59/1488 ,  C08G59/4071 ,  C08G59/446

Abstract: Provided is a novel phosphorus-containing compound represented by general formula (I). The compound has reactivity with a glycidyl group and is therefore capable of providing a curing epoxy resin composition that is expected to achieve flame retardation and reduction of dielectric constant. wherein m is a number of 1 to 10; R1, R2, R3, and R4 are each hydrogen, alkyl, or aryl; R5 is alkyl, alkanediyl, alkanetriyl, alkanetetrayl, or an aromatic group; X is oxygen or sulfur; Y is oxygen, sulfur, or ═NR′; and R′ is hydrogen, alkyl, or aryl.

公开(公告)号：US10655005B2

公开(公告)日：2020-05-19

申请号：US15560773

申请日：2016-03-22

Applicant: ADEKA CORPORATION

Inventor： Takeshi Endo ,  Kozo Matsumoto ,  Ken-ichi Tamaso ,  Chihiro Asakura ,  Ryo Ogawa

IPC: C08L63/00 ,  C08J5/24 ,  C08K5/5399 ,  C08K5/00

Abstract: An epoxy resin composition comprising an epoxy resin (A), a curing agent (B) and a phosphorous-containing compound (C) indicated by the following general formula (1) and also, if necessary, a flame retardant (D), and a laminated plate comprising said resin composition; wherein m indicates an integer from 2 to 10, R1 to R4 each independently indicate a hydrogen atom, an alkyl group or an aryl group, R5 indicates a hydrocarbon group that may contain an oxygen atom, a sulfur atom or a nitrogen atom, X indicates an oxygen atom or a sulfur atom, Y indicates an oxygen atom, a sulfur atom or —NR6—, and R6 indicates a hydrogen atom, an alkyl group or an aryl group.

公开(公告)号：US10144799B2

公开(公告)日：2018-12-04

申请号：US14913431

申请日：2014-08-18

Applicant: ADEKA CORPORATION

Inventor： Ryo Ogawa ,  Takuya Matsuda

IPC: C08G59/66 ,  C08G59/24 ,  C08G59/50 ,  C08G59/56

Abstract: A one-component curable resin composition that does not contain an isocyanate compound, comprised of uniformly blended (A) a compound having two or more epoxy groups within a molecule, (B) a compound having two or more thiol groups within a molecule, and (C) an imidazole compound of formula (I), wherein the component (C) exists in the form of liquid.