公开(公告)号：US11613625B2

公开(公告)日：2023-03-28

申请号：US16921334

申请日：2020-07-06

Applicant: ADMATECHS CO., LTD.

Inventor： Shinta Hagimoto ,  Nobutaka Tomita ,  Osamu Nakano

IPC: C08K9/06 ,  C08K3/34 ,  C08K7/18 ,  C09C1/40 ,  C09C3/12

Abstract: A filler for resinous composition is contained and used in resinous composition, and includes: a crystalline siliceous particulate material with a crystal structure made of at least one member selected from the group consisting of type FAU, type FER, type LTA and type MFI, and/or type MWW; and a surface treatment agent including an organic silica compound reacted with or adhered to a surface of the crystalline siliceous particulate material; the filler including the surface treatment agent in an amount falling in a range allowing the filler to exhibit a negative thermal expansion coefficient.