Electronic material filler, high-frequency substrate, and electronic material slurry

    公开(公告)号:US10851246B2

    公开(公告)日:2020-12-01

    申请号:US16715204

    申请日:2019-12-16

    Abstract: A production method for an electronic material filler includes: a preparation step of preparing a silica particle material produced by a dry method; and a first surface treatment step of performing surface treatment on the silica particle material with a silane compound having a vinyl group, a phenyl group, a phenylamino group, an alkyl group having four or more carbon atoms, a methacryl group, or an epoxy group, to obtain a first surface treatment-processed particle material. After the silica particle material is produced by the dry method, the silica particle material is not brought into contact with liquid water, and has a particle diameter of 100 nm to 600 nm or a specific surface area of 5 m2/g to 35 m2/g.

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