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公开(公告)号：US20210313248A1
公开(公告)日：2021-10-07
申请号：US17353115
申请日：2021-06-21
Applicant: ADVANCED MICRO DEVICES, INC.
Inventor： MANISH ARORA , NUWAN JAYASENA
IPC: H01L23/427 , H05K1/02
Abstract: Various circuit board embodiments are disclosed. In one aspect, an apparatus is provided that includes a circuit board and a first phase change material pocket positioned on or in the circuit board and contacting a surface of the circuit board.
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