Pattern width measuring apparatus, pattern width measuring method, and electron beam exposure apparatus
    1.
    发明申请
    Pattern width measuring apparatus, pattern width measuring method, and electron beam exposure apparatus 失效
    图案宽度测量装置,图案宽度测量方法和电子束曝光装置

    公开(公告)号:US20040065825A1

    公开(公告)日:2004-04-08

    申请号:US10664440

    申请日:2003-09-18

    CPC classification number: H01J37/28 H01J2237/2814 H01J2237/2817

    Abstract: A pattern width measuring apparatus for accurately measuring pattern width of a pattern formed on a wafer using an electron beam. The pattern widthmeasuring apparatus includes: an electron gun for generating the electron beam; a deflector for scanning the pattern with the electron beam by deflecting the electron beam; a first secondary electron detector and a second secondary electron detector for detecting secondary electrons generated when the electron beam is irradiated on the pattern; a first edge detector for detecting position of a first edge of the pattern based on the quantity of the secondary electrons detected by the first secondary electron detector; a second edge detector for detecting position of a second edge of the pattern based on the quantity of the secondary electrons detected by the second secondary electron detector; and a pattern width computing section for computing pattern width of the pattern based on the position of the first edge and the position of the second edge detected by the first edge detector and the second edge detector.

    Abstract translation: 一种用于使用电子束精确测量在晶片上形成的图案的图形宽度的图案宽度测量装置。 图案宽度测量装置包括:用于产生电子束的电子枪; 用于通过偏转电子束用电子束扫描图案的偏转器; 第一二次电子检测器和第二二次电子检测器,用于检测当电子束照射在图案上时产生的二次电子; 第一边缘检测器,用于基于由第一二次电子检测器检测到的二次电子的量来检测图案的第一边缘的位置; 第二边缘检测器,用于基于由第二二次电子检测器检测到的二次电子的量来检测图案的第二边缘的位置; 以及图案宽度计算部分,用于基于由第一边缘检测器和第二边缘检测器检测到的第一边缘的位置和第二边缘的位置来计算图案的图案宽度。

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