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公开(公告)号:US20230183130A1
公开(公告)日:2023-06-15
申请号:US18059034
申请日:2022-11-28
Applicant: AGC Inc.
Inventor: Mamoru ISOBE , Kohei HORIUCHI , Katsuaki MIYATANI , Naoki UEMURA , Akiko OSAKI
CPC classification number: C03C23/0025 , C03C15/00 , C03C19/00 , C03C23/0075
Abstract: A method of manufacturing a glass substrate having a penetrating structure, the method includes: (1) preparing a glass substrate that has a first surface and a second surface opposite to each other, and includes 3 mol % to 30 mol % of B2O3 in terms of oxide; (2) having the glass substrate irradiated with a laser from a first surface side, to form an initial penetrating structure; (3) wet etching the glass substrate having the initial penetrating structure formed; (4) polishing the wet-etched glass substrate from the first surface side, by using an abrasive including acid-soluble abrasive grains; and (5) cleaning the glass substrate with an acid solution.