公开(公告)号：US20230183130A1

公开(公告)日：2023-06-15

申请号：US18059034

申请日：2022-11-28

Applicant: AGC Inc.

Inventor： Mamoru ISOBE ,  Kohei HORIUCHI ,  Katsuaki MIYATANI ,  Naoki UEMURA ,  Akiko OSAKI

IPC: C03C23/00 ,  C03C15/00 ,  C03C19/00

CPC classification number: C03C23/0025 ,  C03C15/00 ,  C03C19/00 ,  C03C23/0075

Abstract: A method of manufacturing a glass substrate having a penetrating structure, the method includes: (1) preparing a glass substrate that has a first surface and a second surface opposite to each other, and includes 3 mol % to 30 mol % of B2O3 in terms of oxide; (2) having the glass substrate irradiated with a laser from a first surface side, to form an initial penetrating structure; (3) wet etching the glass substrate having the initial penetrating structure formed; (4) polishing the wet-etched glass substrate from the first surface side, by using an abrasive including acid-soluble abrasive grains; and (5) cleaning the glass substrate with an acid solution.

公开(公告)号：US20240407089A1

公开(公告)日：2024-12-05

申请号：US18804505

申请日：2024-08-14

Applicant: AGC INC.

Inventor： Kent SUGA ,  Hidetoshi MATSUMOTO ,  Katsuaki MIYATANI

IPC: H05K1/03 ,  C03B19/14 ,  C03C11/00 ,  H01L23/15

Abstract: The present invention relates to a silica glass substrate including: a first main surface and a second main surface that are facing each other, in which the silica glass substrate has a density of 2.0 g/cm3 or less, the silica glass substrate includes a plurality of bubbles, the silica glass substrate has an average diameter of first recessed portions of 30 μm or less, the first recessed portions being formed by the bubbles exposed on the first main surface, and the silica glass substrate has the number of the first recessed portions of 200/mm2 or less on the first main surface.