公开(公告)号：US20240030051A1

公开(公告)日：2024-01-25

申请号：US18479872

申请日：2023-10-03

Applicant: AGC Inc.

Inventor： Yuha KOBAYASHI ,  Yuichi YOSHIDA ,  Keisuke HANASHIMA

IPC: H01L21/67 ,  H01L21/304 ,  H01L21/66 ,  H01L23/15 ,  C03C15/02

CPC classification number: H01L21/67288 ,  H01L21/67253 ,  H01L21/304 ,  H01L22/12 ,  H01L23/15 ,  C03C15/02

Abstract: To suppress lowering of dimensional accuracy. A manufacturing method for a glass substrate is a manufacturing method for the glass substrate that supports a semiconductor device, the manufacturing method including: generating a glass base plate; measuring a thickness, a thickness deviation, and a warpage amount of the glass base plate; screening the glass base plate based on the thickness of the glass base plate; generating a plurality of glass blanks by cutting the screened glass base plate; setting a first polishing condition for the glass blank based on the thickness, the thickness deviation, and the warpage amount of the glass base plate; generating a glass plate by polishing a surface of the glass blank based on the first polishing condition; measuring a thickness, a thickness deviation, and a warpage amount of the glass plate; screening the glass plate based on the thickness of the glass plate; setting a second polishing condition for the glass plate based on the thickness, the thickness deviation, and the warpage amount of the glass plate; and polishing a surface of the screened glass plate based on the second polishing condition to generate a rectangular glass substrate in which a length of a side is equal to or larger than 300 mm and a thickness is equal to or larger than 0.5 mm.