公开(公告)号：US10755993B2

公开(公告)日：2020-08-25

申请号：US16084554

申请日：2017-03-16

Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH

Inventor： David Ho ,  Vempati Srinivasa Rao ,  Tai Chong Chai ,  Surya Bhattacharya

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/498 ,  H01L23/538 ,  H01L25/00 ,  H01L23/00

Abstract: Various embodiments may provide an electrical connection structure. The electrical connection structure may include a first substrate having a first surface defining a cavity, and an inner wall defining a via extending from the cavity. The electrical connection structure may also include an interconnect structure provided in the via so that at least a portion of the interconnect structure protrudes into the cavity. The electrical connection structure may further include a second substrate having a second surface facing the first surface. The electrical connection structure may additionally include a connection element on the second surface. At least a portion of the connection element may be received in the cavity so that the connection element is in electrical connection with the interconnect structure.