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公开(公告)号:US20240228067A1
公开(公告)日:2024-07-11
申请号:US18557222
申请日:2022-04-14
CPC分类号: B64G1/503 , B64G1/1028 , B64G1/58 , B33Y80/00
摘要: A thermoregulated thermomechanical structure for a focal plane suitable for operating in a space environment is disclosed having an interface for supporting dissipative electronic equipment, the structure being monolithic, metallic and including a radiator and a first two-phase heat-transfer fluid transport cavity, extending within the radiator and providing direct thermal transport between the interface and the radiator. The structure also includes a second cavity encapsulating a phase change material.